TY - JOUR
T1 - High temperature surface measurements using lifetime imaging of thermographic phosphors
T2 - Bonding tests
AU - Allison, S. W.
AU - Beshears, D. L.
AU - Gadfort, Thomas
AU - Bencic, T.
AU - Eldridge, J.
AU - Hollerman, W. A.
AU - Boudreaux, P.
PY - 2001
Y1 - 2001
N2 - Temperature-sensitive paint (TSP) comprised of thermally sensitive phosphor can provide a viable means for noncontact thermometry in wind tunnel and other aeropropulsion applications. Described here are recent results aimed at developing a phosphor and binder system that will cover a wide temperature range, ambient to 1000 C. The phosphor/binder mixture is to be sprayed directly on the surface with an airbrush. Whereas many surfaces are candidates for various uses, the present effort concerned silicon carbide, silicon nitride and silica substrates. Initial tests show that a phosphor mixture with two water-soluble materials, designated LK and HPC and manufactured by ZYP Inc., adhered well to these substrates. This same material was earlier shown to function well on a high strength nickel alloy.
AB - Temperature-sensitive paint (TSP) comprised of thermally sensitive phosphor can provide a viable means for noncontact thermometry in wind tunnel and other aeropropulsion applications. Described here are recent results aimed at developing a phosphor and binder system that will cover a wide temperature range, ambient to 1000 C. The phosphor/binder mixture is to be sprayed directly on the surface with an airbrush. Whereas many surfaces are candidates for various uses, the present effort concerned silicon carbide, silicon nitride and silica substrates. Initial tests show that a phosphor mixture with two water-soluble materials, designated LK and HPC and manufactured by ZYP Inc., adhered well to these substrates. This same material was earlier shown to function well on a high strength nickel alloy.
UR - http://www.scopus.com/inward/record.url?scp=0035164661&partnerID=8YFLogxK
U2 - 10.1109/ICIASF.2001.960248
DO - 10.1109/ICIASF.2001.960248
M3 - Article
AN - SCOPUS:0035164661
SN - 0730-2010
SP - 171
EP - 176
JO - ICIASF Record, International Congress on Instrumentation in Aerospace Simulation Facilities
JF - ICIASF Record, International Congress on Instrumentation in Aerospace Simulation Facilities
ER -