High seebeck effects from hybrid metal/polymer/metal thin-film devices

Liang Yan; Ming Shao; Hsin Wang; Douglas Dudis; Augustine Urbas; Bin Hu

doi:10.1002/adma.201101634

High seebeck effects from hybrid metal/polymer/metal thin-film devices

Liang Yan
, Ming Shao
, Hsin Wang
, Douglas Dudis
, Augustine Urbas
, Bin Hu

Applied Microanalysis and Thermophysics

Research output: Contribution to journal › Article › peer-review

55 Scopus citations

Abstract

The multi-layer metal/polymer/metal thin-film structure allows charge conduction but limits thermal conduction. The charge conduction is supported by Ohmic interfacial charge transfer and doped bulk transport. The thermal conduction is limited by polymer low thermal conductivity, acoustic mismatch, interfacial phonon scattering. As a result, the metal/polymer/metal thin-film devices can demonstrate significant Seebeck effect.

Original language	English
Pages (from-to)	4120-4124
Number of pages	5
Journal	Advanced Materials
Volume	23
Issue number	35
DOIs	https://doi.org/10.1002/adma.201101634
State	Published - Sep 15 2011

Keywords

electrical conduction
hybrid
multi-layer
organic
thermoelectric

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10.1002/adma.201101634

Cite this

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title = "High seebeck effects from hybrid metal/polymer/metal thin-film devices",

abstract = "The multi-layer metal/polymer/metal thin-film structure allows charge conduction but limits thermal conduction. The charge conduction is supported by Ohmic interfacial charge transfer and doped bulk transport. The thermal conduction is limited by polymer low thermal conductivity, acoustic mismatch, interfacial phonon scattering. As a result, the metal/polymer/metal thin-film devices can demonstrate significant Seebeck effect.",

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author = "Liang Yan and Ming Shao and Hsin Wang and Douglas Dudis and Augustine Urbas and Bin Hu",

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doi = "10.1002/adma.201101634",

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T1 - High seebeck effects from hybrid metal/polymer/metal thin-film devices

AU - Yan, Liang

AU - Shao, Ming

AU - Wang, Hsin

AU - Dudis, Douglas

AU - Urbas, Augustine

AU - Hu, Bin

PY - 2011/9/15

Y1 - 2011/9/15

N2 - The multi-layer metal/polymer/metal thin-film structure allows charge conduction but limits thermal conduction. The charge conduction is supported by Ohmic interfacial charge transfer and doped bulk transport. The thermal conduction is limited by polymer low thermal conductivity, acoustic mismatch, interfacial phonon scattering. As a result, the metal/polymer/metal thin-film devices can demonstrate significant Seebeck effect.

AB - The multi-layer metal/polymer/metal thin-film structure allows charge conduction but limits thermal conduction. The charge conduction is supported by Ohmic interfacial charge transfer and doped bulk transport. The thermal conduction is limited by polymer low thermal conductivity, acoustic mismatch, interfacial phonon scattering. As a result, the metal/polymer/metal thin-film devices can demonstrate significant Seebeck effect.

KW - electrical conduction

KW - hybrid

KW - multi-layer

KW - organic

KW - thermoelectric

UR - https://www.scopus.com/pages/publications/80052533258

U2 - 10.1002/adma.201101634

DO - 10.1002/adma.201101634

M3 - Article

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AN - SCOPUS:80052533258

SN - 0935-9648

VL - 23

SP - 4120

EP - 4124

JO - Advanced Materials

JF - Advanced Materials

IS - 35

ER -

High seebeck effects from hybrid metal/polymer/metal thin-film devices

Abstract

Keywords

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