Abstract
Epitaxial CdSe films were grown on (0 0 1)-oriented and 2°-miscut GaAs wafers at platen temperatures (Tp) of 250-425°C by ArF (193 nm) pulsed excimer laser ablation of a stoichiometric CdSe target in vacuum and low-pressure Ar gas. The substrates were bonded to the platen with indium solder or silver paint. Auger electron spectroscopy (AES) combined with ion sputtering and energy dispersive X-ray fluorescent spectroscopy were employed to investigate film-substrate interdiffusion, the presence of indium or silver in the films, and CdSe film stoichiometry, all as functions of the film-growth conditions. Extensive interdiffusion took place at the film-substrate interface for CdSe films grown at Tp ≥ 355°C but was greatly reduced at Tp = 250°C. Tilting the substrate to be approximately parallel to the ablation plume as well as increasing the ambient gas pressure also reduced film-substrate interdiffusion. Indium was found in films deposited at Tp ≥ 355°C while no In was detected in films deposited at Tp = 250°C. AES depth profiling showed that the In concentration was highest at the CdSe film surface and that the Cd concentration varied inversely with the In concentration. At higher In concentrations the Se concentration also varied inversely with the In concentration in the near-surface region, implying that In clusters or interstitials may exist in addition to substitutional indium. In the absence of indium diffusion the CdSe films were nearly stoichiometric. No silver was found in any film.
Original language | English |
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Pages (from-to) | 516-527 |
Number of pages | 12 |
Journal | Journal of Crystal Growth |
Volume | 193 |
Issue number | 4 |
DOIs | |
State | Published - Oct 15 1998 |
Funding
This research was sponsored by the Oak Ridge National Laboratory, managed by Lockheed Martin Energy Research Corporation for the U.S. Department of Energy under contract DE-AC05-96OR22464. The authors thank S. Cristy for arranging the use of the AES instrument and B.C. Sales and P.H. Fleming for their helpful comments during the EDS work.