Helium release and microstructural changes in Er(D,T)2-x3Hex films

C. S. Snow, L. N. Brewer, D. S. Gelles, M. A. Rodriguez, P. G. Kotula, J. C. Banks, M. A. Mangan, J. F. Browning

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    42 Scopus citations

    Abstract

    Er(D,T)2-x3Hex, erbium di-tritide, films of thicknesses 500 nm, 400 nm, 300 nm, 200 nm, and 100 nm were grown and analyzed by transmission electron microscopy, X-ray diffraction, and ion beam analysis to determine variations in film micro-structure as a function of film thickness and age, due to the time-dependent build-up of 3He in the film from the radioactive decay of tritium. Several interesting features were observed: One, the amount of helium released as a function of film thickness is relatively constant. This suggests that the helium is being released only from the near surface region and that the helium is not diffusing to the surface from the bulk of the film. Two, lenticular helium bubbles are observed as a result of the radioactive decay of tritium into 3He. These bubbles grow along the [1 1 1] crystallographic direction. Three, a helium bubble free zone, or 'denuded zone' is observed near the surface. The size of this region is independent of film thickness. Four, an analysis of secondary diffraction spots in the Transmission Electron Microscopy study indicate that small erbium oxide precipitates, 5-10 nm in size, exist throughout the film. Further, all of the films had large erbium oxide inclusions, in many cases these inclusions span the depth of the film.

    Original languageEnglish
    Pages (from-to)147-157
    Number of pages11
    JournalJournal of Nuclear Materials
    Volume374
    Issue number1-2
    DOIs
    StatePublished - Feb 29 2008

    Funding

    The authors would like to acknowledge G. Bryant and C. Hill for the TEM sample preparation. This work was performed at and supported by Sandia National Laboratories. Sandia is a multiprogram laboratory operated by Sandia Corporation, a Lockheed Martin Company, for the United States Department of Energy under contract DE-AC04-94AL85000.

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