Formulated poly (butyl vinyl ether) adhesives as alternative materials for direct ink writing (DIW) 3D printing

Anh Nguyen; G. M.Fazley Elahee; Xiang Cheng; Charles Patten; Lihan Rong; Chase Breting; Jose Bonilla-Cruz; Tania Ernestina Lara Ceniceros; Zane Smith; Jin Ge; Mingwei Xu; Matthew Yang; Rigoberto Advincula

doi:10.1557/s43579-023-00477-5

Formulated poly (butyl vinyl ether) adhesives as alternative materials for direct ink writing (DIW) 3D printing

Anh Nguyen, G. M.Fazley Elahee, Xiang Cheng, Charles Patten, Lihan Rong, Chase Breting, Jose Bonilla-Cruz, Tania Ernestina Lara Ceniceros, Zane Smith, Jin Ge, Mingwei Xu, Matthew Yang, Rigoberto Advincula

Macromolecular Nanomaterials

Research output: Contribution to journal › Article › peer-review

1 Scopus citations

Abstract

Direct Ink Writing (DIW) is a promising 3D printing method for controlled multi-material deposition to make well-defined geometrical structures. Stringent rheological requirements enable the additive build-up of extruded layers. Although commercially available, no occasion has been reported on poly(butyl vinyl ether) adhesives for DIW. The moisture curing mechanism and thixotropic build-up indicate an alternative route to cross-linking curing to thermoset elastomers. Chemical composition and rheological characterizations were conducted to evaluate printability and physicochemical properties (i.e., dielectric properties, thermal conductivity, etc.) to address the potential for further reformulation and study with nanomaterial additives. Graphical abstract: [Figure not available: see fulltext.]

Original language	English
Pages (from-to)	1407-1415
Number of pages	9
Journal	MRS Communications
Volume	13
Issue number	6
DOIs	https://doi.org/10.1557/s43579-023-00477-5
State	Published - Dec 2023

Funding

We acknowledge technical support from Frontier Laboratories and Quantum Analytics. This work (or part of this work) was conducted in Oak Ridge National Laboratory Center for Nanophase Materials Sciences (CNMS) by R C Advincula. CNMS is a US Department of Energy Office of Science User Facility.

Keywords

3D printing
Adhesion
Chemical composition
Polymer
Viscoelasticity

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10.1557/s43579-023-00477-5

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title = "Formulated poly (butyl vinyl ether) adhesives as alternative materials for direct ink writing (DIW) 3D printing",

abstract = "Direct Ink Writing (DIW) is a promising 3D printing method for controlled multi-material deposition to make well-defined geometrical structures. Stringent rheological requirements enable the additive build-up of extruded layers. Although commercially available, no occasion has been reported on poly(butyl vinyl ether) adhesives for DIW. The moisture curing mechanism and thixotropic build-up indicate an alternative route to cross-linking curing to thermoset elastomers. Chemical composition and rheological characterizations were conducted to evaluate printability and physicochemical properties (i.e., dielectric properties, thermal conductivity, etc.) to address the potential for further reformulation and study with nanomaterial additives. Graphical abstract: [Figure not available: see fulltext.]",

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AU - Nguyen, Anh

AU - Elahee, G. M.Fazley

AU - Cheng, Xiang

AU - Patten, Charles

AU - Rong, Lihan

AU - Breting, Chase

AU - Bonilla-Cruz, Jose

AU - Ceniceros, Tania Ernestina Lara

AU - Smith, Zane

AU - Ge, Jin

AU - Xu, Mingwei

AU - Yang, Matthew

AU - Advincula, Rigoberto

PY - 2023/12

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N2 - Direct Ink Writing (DIW) is a promising 3D printing method for controlled multi-material deposition to make well-defined geometrical structures. Stringent rheological requirements enable the additive build-up of extruded layers. Although commercially available, no occasion has been reported on poly(butyl vinyl ether) adhesives for DIW. The moisture curing mechanism and thixotropic build-up indicate an alternative route to cross-linking curing to thermoset elastomers. Chemical composition and rheological characterizations were conducted to evaluate printability and physicochemical properties (i.e., dielectric properties, thermal conductivity, etc.) to address the potential for further reformulation and study with nanomaterial additives. Graphical abstract: [Figure not available: see fulltext.]

AB - Direct Ink Writing (DIW) is a promising 3D printing method for controlled multi-material deposition to make well-defined geometrical structures. Stringent rheological requirements enable the additive build-up of extruded layers. Although commercially available, no occasion has been reported on poly(butyl vinyl ether) adhesives for DIW. The moisture curing mechanism and thixotropic build-up indicate an alternative route to cross-linking curing to thermoset elastomers. Chemical composition and rheological characterizations were conducted to evaluate printability and physicochemical properties (i.e., dielectric properties, thermal conductivity, etc.) to address the potential for further reformulation and study with nanomaterial additives. Graphical abstract: [Figure not available: see fulltext.]

KW - 3D printing

KW - Adhesion

KW - Chemical composition

KW - Polymer

KW - Viscoelasticity

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Formulated poly (butyl vinyl ether) adhesives as alternative materials for direct ink writing (DIW) 3D printing

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