Formation of intermetallic compounds in Mg-Ag-Al joints during diffusion bonding

Yiyu Wang; Guoqiang Luo; Leijun Li; Qiang Shen; Lianmeng Zhang

doi:10.1007/s10853-014-8440-8

Formation of intermetallic compounds in Mg-Ag-Al joints during diffusion bonding

Yiyu Wang, Guoqiang Luo, Leijun Li, Qiang Shen, Lianmeng Zhang

Research output: Contribution to journal › Article › peer-review

26 Scopus citations

Abstract

In this study, we conducted the diffusion bonding of Mg and Al alloys using a 30-μm-thick pure silver foil interlayer at median temperatures between 390 and 490 &Deg;C. We obtained a multilayered structure across the Mg-Ag-Al joint: Mg/Mg(ss, Ag)/Mg₃Ag/MgAg/Ag/Ag(ss, Al)/Ag₂Al/Al. The silver diffusion barrier prevented the formation of brittle intermetallics between Mg and Al. Intermetallics identified at the joint interface include the more ductile types between Mg and Ag, ε-Mg₃Ag and β'-MgAg, and Ag and Al, Δ-Ag₂Al. As the bonding temperature increased, Ag₂Al, followed by MgAg, favored the growth of Mg ₃Ag IMC layer. The shear strength of the joints increased with the rising bonding temperature to a maximum value of 11.8 MPa at 470 &Deg;C. Fracture failure in the joints mainly occurred in the Ag₂Al layer. The formation mechanism for interfacial layers in the joints is believed to consist of four stages: (1) solid-solution formation, (2) Mg-Ag IMC formation, (3) Ag-Al IMC formation, and (4) growth of Mg-Ag and Ag-Al IMCs.

Original language	English
Pages (from-to)	7298-7308
Number of pages	11
Journal	Journal of Materials Science
Volume	49
Issue number	20
DOIs	https://doi.org/10.1007/s10853-014-8440-8
State	Published - Oct 2014
Externally published	Yes

Funding

Acknowledgements The authors gratefully acknowledge financial support from the National Natural Science Foundation of China (No: 51202175), the 111 Project (B13035) of China, the Fundamental Research Funds for the Central Universities (WUT: 2013-II-024), State Key Laboratory of Advanced Technology for Materials Synthesis and Processing (Wuhan University of Technology, Grant No: 2014-KF-7) and China Scholarship Council.

Funders	Funder number
National Natural Science Foundation of China	51202175
China Scholarship Council
Wuhan University of Technology	2014-KF-7
Fundamental Research Funds for the Central Universities	2013-II-024
Higher Education Discipline Innovation Project	B13035

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title = "Formation of intermetallic compounds in Mg-Ag-Al joints during diffusion bonding",

abstract = "In this study, we conducted the diffusion bonding of Mg and Al alloys using a 30-μm-thick pure silver foil interlayer at median temperatures between 390 and 490 &Deg;C. We obtained a multilayered structure across the Mg-Ag-Al joint: Mg/Mg(ss, Ag)/Mg3Ag/MgAg/Ag/Ag(ss, Al)/Ag2Al/Al. The silver diffusion barrier prevented the formation of brittle intermetallics between Mg and Al. Intermetallics identified at the joint interface include the more ductile types between Mg and Ag, ε-Mg3Ag and β'-MgAg, and Ag and Al, Δ-Ag2Al. As the bonding temperature increased, Ag2Al, followed by MgAg, favored the growth of Mg 3Ag IMC layer. The shear strength of the joints increased with the rising bonding temperature to a maximum value of 11.8 MPa at 470 &Deg;C. Fracture failure in the joints mainly occurred in the Ag2Al layer. The formation mechanism for interfacial layers in the joints is believed to consist of four stages: (1) solid-solution formation, (2) Mg-Ag IMC formation, (3) Ag-Al IMC formation, and (4) growth of Mg-Ag and Ag-Al IMCs.",

author = "Yiyu Wang and Guoqiang Luo and Leijun Li and Qiang Shen and Lianmeng Zhang",

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T1 - Formation of intermetallic compounds in Mg-Ag-Al joints during diffusion bonding

AU - Wang, Yiyu

AU - Luo, Guoqiang

AU - Li, Leijun

AU - Shen, Qiang

AU - Zhang, Lianmeng

PY - 2014/10

Y1 - 2014/10

N2 - In this study, we conducted the diffusion bonding of Mg and Al alloys using a 30-μm-thick pure silver foil interlayer at median temperatures between 390 and 490 &Deg;C. We obtained a multilayered structure across the Mg-Ag-Al joint: Mg/Mg(ss, Ag)/Mg3Ag/MgAg/Ag/Ag(ss, Al)/Ag2Al/Al. The silver diffusion barrier prevented the formation of brittle intermetallics between Mg and Al. Intermetallics identified at the joint interface include the more ductile types between Mg and Ag, ε-Mg3Ag and β'-MgAg, and Ag and Al, Δ-Ag2Al. As the bonding temperature increased, Ag2Al, followed by MgAg, favored the growth of Mg 3Ag IMC layer. The shear strength of the joints increased with the rising bonding temperature to a maximum value of 11.8 MPa at 470 &Deg;C. Fracture failure in the joints mainly occurred in the Ag2Al layer. The formation mechanism for interfacial layers in the joints is believed to consist of four stages: (1) solid-solution formation, (2) Mg-Ag IMC formation, (3) Ag-Al IMC formation, and (4) growth of Mg-Ag and Ag-Al IMCs.

AB - In this study, we conducted the diffusion bonding of Mg and Al alloys using a 30-μm-thick pure silver foil interlayer at median temperatures between 390 and 490 &Deg;C. We obtained a multilayered structure across the Mg-Ag-Al joint: Mg/Mg(ss, Ag)/Mg3Ag/MgAg/Ag/Ag(ss, Al)/Ag2Al/Al. The silver diffusion barrier prevented the formation of brittle intermetallics between Mg and Al. Intermetallics identified at the joint interface include the more ductile types between Mg and Ag, ε-Mg3Ag and β'-MgAg, and Ag and Al, Δ-Ag2Al. As the bonding temperature increased, Ag2Al, followed by MgAg, favored the growth of Mg 3Ag IMC layer. The shear strength of the joints increased with the rising bonding temperature to a maximum value of 11.8 MPa at 470 &Deg;C. Fracture failure in the joints mainly occurred in the Ag2Al layer. The formation mechanism for interfacial layers in the joints is believed to consist of four stages: (1) solid-solution formation, (2) Mg-Ag IMC formation, (3) Ag-Al IMC formation, and (4) growth of Mg-Ag and Ag-Al IMCs.

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Formation of intermetallic compounds in Mg-Ag-Al joints during diffusion bonding

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