Formation of a buried soft layer in SiC for 'compliant substrate' by ion implantation

M. Lioubtchenko, J. Hunn, A. Suvkhanov, N. Parikh, D. Bray

Research output: Contribution to journalConference articlepeer-review

Abstract

Radiation damage and its removal have been studied in ion implanted 6H-SiC by Rutherford backscattering/Channeling (RBS). We have implanted Ga and Ti at 800°C using doses of 1 × 1016 to 2 × 1017 cm-2. The implanted samples have been subsequently annealed at 1050°C, and then at 1400°C for 30 sec to study the removal of damage produced during implantation. The energies of implanted species have been chose to obtain 20 - 40 nm projected ranges to form a buried metallic or graphitic layer. No significant damage removal has been observed after 1050°C anneal, however 1400°C annealing of 40 and 120 keV Ga implanted samples (fluence 2 × 1016 cm-2) resulted in significantly less damage as can be observed from RBS/Channeling data. In the case of Ti implanted samples annealing led to an appreciable increase in the channeled backscattering yield, which might be due to the formation of some new phase (e.g. TiSi or TiSi2) and may be related to distortions of the existing lattice.

Original languageEnglish
Pages (from-to)265-270
Number of pages6
JournalMaterials Research Society Symposium - Proceedings
Volume438
DOIs
StatePublished - 1996
Externally publishedYes
EventProceedings of the 1996 MRS Fall Meeting - Boston, MA, USA
Duration: Dec 2 1996Dec 6 1996

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