Ferroelectric Si-Doped HfO2 Device Properties on Highly Doped Germanium

Patrick D. Lomenzo, Qanit Takmeel, Chris M. Fancher, Chuanzhen Zhou, Nicholas G. Rudawski, Saeed Moghaddam, Jacob L. Jones, Toshikazu Nishida

Research output: Contribution to journalArticlepeer-review

70 Scopus citations

Abstract

Ferroelectric Si-doped HfO2 thin films are integrated into three different device stacks with a p+ Ge substrate, a p+ Si substrate, and a TaN bottom metal gate. The ferroelectric behavior of the Si-doped HfO2 thin films is strongly dependent on the bottom interfaces. The Si-doped HfO2 thin films have favorably improved ferroelectric properties on the p+ Ge substrate due to the lack of a dielectric interfacial layer between HfO2 and Ge. The low-voltage operation and cycling stability of Si-doped HfO2 ferroelectric thin films on Ge can lead to the realization of high performance, robust Ge ferroelectric field-effect transistors for nonvolatile memory applications.

Original languageEnglish
Article number7123616
Pages (from-to)766-768
Number of pages3
JournalIEEE Electron Device Letters
Volume36
Issue number8
DOIs
StatePublished - Aug 1 2015
Externally publishedYes

Keywords

  • FeFETs
  • Ferroelectrics
  • Ge
  • HfO

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