Abstract
Ferroelectric Si-doped HfO2 thin films are integrated into three different device stacks with a p+ Ge substrate, a p+ Si substrate, and a TaN bottom metal gate. The ferroelectric behavior of the Si-doped HfO2 thin films is strongly dependent on the bottom interfaces. The Si-doped HfO2 thin films have favorably improved ferroelectric properties on the p+ Ge substrate due to the lack of a dielectric interfacial layer between HfO2 and Ge. The low-voltage operation and cycling stability of Si-doped HfO2 ferroelectric thin films on Ge can lead to the realization of high performance, robust Ge ferroelectric field-effect transistors for nonvolatile memory applications.
| Original language | English |
|---|---|
| Article number | 7123616 |
| Pages (from-to) | 766-768 |
| Number of pages | 3 |
| Journal | IEEE Electron Device Letters |
| Volume | 36 |
| Issue number | 8 |
| DOIs | |
| State | Published - Aug 1 2015 |
| Externally published | Yes |
Keywords
- FeFETs
- Ferroelectrics
- Ge
- HfO