Fast thermal simulations of vertically integrated circuits (3D ICs) including thermal vias

Amirkoushyar Ziabari, Ali Shakouri

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

16 Scopus citations

Abstract

A fast convolution-based technique, deemed Power Blurring, is demonstrated for thermal analysis of 3D ICs, including thermal vias. The temperature resulting from any power may in each layer of the chip can be computed without the need to re-mesh the whole structure. The maximum error in estimation time is reduced by a factor of 76x compared to finite element software.

Original languageEnglish
Title of host publicationProceedings of the 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012
Pages588-596
Number of pages9
DOIs
StatePublished - 2012
Externally publishedYes
Event13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012 - San Diego, CA, United States
Duration: May 30 2012Jun 1 2012

Publication series

NameInterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
ISSN (Print)1936-3958

Conference

Conference13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012
Country/TerritoryUnited States
CitySan Diego, CA
Period05/30/1206/1/12

Keywords

  • 3D IC
  • Fast Thermal Simulation
  • Power Blurring Method
  • Thermal Via

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