Fast thermal simulations of vertically integrated circuits (3D ICs) including thermal vias

Amirkoushyar Ziabari; Ali Shakouri

doi:10.1109/ITHERM.2012.6231482

Fast thermal simulations of vertically integrated circuits (3D ICs) including thermal vias

Amirkoushyar Ziabari, Ali Shakouri

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

16 Scopus citations

Abstract

A fast convolution-based technique, deemed Power Blurring, is demonstrated for thermal analysis of 3D ICs, including thermal vias. The temperature resulting from any power may in each layer of the chip can be computed without the need to re-mesh the whole structure. The maximum error in estimation time is reduced by a factor of 76x compared to finite element software.

Original language	English
Title of host publication	Proceedings of the 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012
Pages	588-596
Number of pages	9
DOIs	https://doi.org/10.1109/ITHERM.2012.6231482
State	Published - 2012
Externally published	Yes
Event	13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012 - San Diego, CA, United States Duration: May 30 2012 → Jun 1 2012

Publication series

Name	InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
ISSN (Print)	1936-3958

Conference

Conference	13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012
Country/Territory	United States
City	San Diego, CA
Period	05/30/12 → 06/1/12

Keywords

3D IC
Fast Thermal Simulation
Power Blurring Method
Thermal Via

Access to Document

10.1109/ITHERM.2012.6231482

Cite this

Ziabari, A., & Shakouri, A. (2012). Fast thermal simulations of vertically integrated circuits (3D ICs) including thermal vias. In Proceedings of the 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012 (pp. 588-596). Article 6231482 (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM). https://doi.org/10.1109/ITHERM.2012.6231482

Ziabari, Amirkoushyar ; Shakouri, Ali. / Fast thermal simulations of vertically integrated circuits (3D ICs) including thermal vias. Proceedings of the 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012. 2012. pp. 588-596 (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM).

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title = "Fast thermal simulations of vertically integrated circuits (3D ICs) including thermal vias",

abstract = "A fast convolution-based technique, deemed Power Blurring, is demonstrated for thermal analysis of 3D ICs, including thermal vias. The temperature resulting from any power may in each layer of the chip can be computed without the need to re-mesh the whole structure. The maximum error in estimation time is reduced by a factor of 76x compared to finite element software.",

keywords = "3D IC, Fast Thermal Simulation, Power Blurring Method, Thermal Via",

author = "Amirkoushyar Ziabari and Ali Shakouri",

year = "2012",

doi = "10.1109/ITHERM.2012.6231482",

language = "English",

isbn = "9781424495320",

series = "InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM",

pages = "588--596",

booktitle = "Proceedings of the 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012",

note = "13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012 ; Conference date: 30-05-2012 Through 01-06-2012",

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Ziabari, A & Shakouri, A 2012, Fast thermal simulations of vertically integrated circuits (3D ICs) including thermal vias. in Proceedings of the 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012., 6231482, InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM, pp. 588-596, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012, San Diego, CA, United States, 05/30/12. https://doi.org/10.1109/ITHERM.2012.6231482

Fast thermal simulations of vertically integrated circuits (3D ICs) including thermal vias. / Ziabari, Amirkoushyar; Shakouri, Ali.
Proceedings of the 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012. 2012. p. 588-596 6231482 (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AB - A fast convolution-based technique, deemed Power Blurring, is demonstrated for thermal analysis of 3D ICs, including thermal vias. The temperature resulting from any power may in each layer of the chip can be computed without the need to re-mesh the whole structure. The maximum error in estimation time is reduced by a factor of 76x compared to finite element software.

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KW - Thermal Via

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Ziabari A, Shakouri A. Fast thermal simulations of vertically integrated circuits (3D ICs) including thermal vias. In Proceedings of the 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012. 2012. p. 588-596. 6231482. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM). doi: 10.1109/ITHERM.2012.6231482

Fast thermal simulations of vertically integrated circuits (3D ICs) including thermal vias

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