Factors limiting the measurement of residual stresses in thin films by nanoindentation

C. M. Lepienski; G. M. Pharr; Y. J. Park; T. R. Watkins; A. Misra; X. Zhang

doi:10.1016/S0040-6090(03)01103-9

Factors limiting the measurement of residual stresses in thin films by nanoindentation

C. M. Lepienski, G. M. Pharr, Y. J. Park, T. R. Watkins, A. Misra, X. Zhang

Neutron & X-Ray Scattering, & Thermophys

Research output: Contribution to journal › Conference article › peer-review

44 Scopus citations

Abstract

Experimental results and finite element simulations are presented to examine whether a recently developed nanoindentation method for measuring residual stresses in bulk, monolithic materials can be applied to thin films. The method is based on indentation with spherical indenters in the elastic-plastic transition regime. Experiments were performed on 7 μm copper films and 5 μm chromium films deposited on (100) silicon substrates using indenters with radii of 30, 69 and 122 μm. The biaxial stresses in the films, which were controlled by processing, were verified by X-ray techniques. Nanoindentation measurement of the film stresses proved difficult due to practical considerations arising from surface roughness, substrate effects and problems in producing an appropriate reference specimen for comparison. Finite element simulations showed that the substrate problems can be alleviated by using an indenter with a radius of the order of (or smaller than) the film thickness. However, the other difficulties pose serious obstacles to the practical implementation of the method to thin film residual stress measurement.

Original language	English
Pages (from-to)	251-257
Number of pages	7
Journal	Thin Solid Films
Volume	447-448
DOIs	https://doi.org/10.1016/S0040-6090(03)01103-9
State	Published - Jan 30 2004
Event	Proceedings of the 30th International Conference on Metallurgie - San Diego, CA, United States Duration: Apr 28 2002 → May 2 2002

Funding

Research at the Oak Ridge National Laboratory SHaRE Collaborative Research Center was sponsored by the Division of Materials Sciences and Engineering, US Department of Energy, under contract DE-AC05-00OR22725 with UT-Battelle, LLC and by the Nanoscience Network Project on Mechanics and Tribology of Microsystems (ERKCM35). Research also sponsored by the Assistant Secretary for Energy Efficiency and Renewable Energy, Office of FreedomCAR and Vehicle Technologies, as part of the High Temperature Materials Laboratory User Program, Oak Ridge National Laboratory, managed by UT-Battelle, LLC, for the US Department of Energy under contract number DE-AC05-00OR22725. One of the authors (CML) wishes to thank CAPES-Brazil for providing sabbatical support for this work.

Funders	Funder number
Office of FreedomCar
US Department of Energy	DE-AC05-00OR22725, ERKCM35
Office of Energy Efficiency and Renewable Energy
Oak Ridge National Laboratory
Division of Materials Sciences and Engineering

Keywords

Chromium
Copper
Nanoindentation
Stress

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10.1016/S0040-6090(03)01103-9

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@article{41c5a4a60371429b9391e8f6e81b9150,

title = "Factors limiting the measurement of residual stresses in thin films by nanoindentation",

abstract = "Experimental results and finite element simulations are presented to examine whether a recently developed nanoindentation method for measuring residual stresses in bulk, monolithic materials can be applied to thin films. The method is based on indentation with spherical indenters in the elastic-plastic transition regime. Experiments were performed on 7 μm copper films and 5 μm chromium films deposited on (100) silicon substrates using indenters with radii of 30, 69 and 122 μm. The biaxial stresses in the films, which were controlled by processing, were verified by X-ray techniques. Nanoindentation measurement of the film stresses proved difficult due to practical considerations arising from surface roughness, substrate effects and problems in producing an appropriate reference specimen for comparison. Finite element simulations showed that the substrate problems can be alleviated by using an indenter with a radius of the order of (or smaller than) the film thickness. However, the other difficulties pose serious obstacles to the practical implementation of the method to thin film residual stress measurement.",

keywords = "Chromium, Copper, Nanoindentation, Stress",

author = "Lepienski, {C. M.} and Pharr, {G. M.} and Park, {Y. J.} and Watkins, {T. R.} and A. Misra and X. Zhang",

year = "2004",

month = jan,

day = "30",

doi = "10.1016/S0040-6090(03)01103-9",

language = "English",

volume = "447-448",

pages = "251--257",

journal = "Thin Solid Films",

issn = "0040-6090",

publisher = "Elsevier",

note = "Proceedings of the 30th International Conference on Metallurgie ; Conference date: 28-04-2002 Through 02-05-2002",

}

TY - JOUR

T1 - Factors limiting the measurement of residual stresses in thin films by nanoindentation

AU - Lepienski, C. M.

AU - Pharr, G. M.

AU - Park, Y. J.

AU - Watkins, T. R.

AU - Misra, A.

AU - Zhang, X.

PY - 2004/1/30

Y1 - 2004/1/30

N2 - Experimental results and finite element simulations are presented to examine whether a recently developed nanoindentation method for measuring residual stresses in bulk, monolithic materials can be applied to thin films. The method is based on indentation with spherical indenters in the elastic-plastic transition regime. Experiments were performed on 7 μm copper films and 5 μm chromium films deposited on (100) silicon substrates using indenters with radii of 30, 69 and 122 μm. The biaxial stresses in the films, which were controlled by processing, were verified by X-ray techniques. Nanoindentation measurement of the film stresses proved difficult due to practical considerations arising from surface roughness, substrate effects and problems in producing an appropriate reference specimen for comparison. Finite element simulations showed that the substrate problems can be alleviated by using an indenter with a radius of the order of (or smaller than) the film thickness. However, the other difficulties pose serious obstacles to the practical implementation of the method to thin film residual stress measurement.

AB - Experimental results and finite element simulations are presented to examine whether a recently developed nanoindentation method for measuring residual stresses in bulk, monolithic materials can be applied to thin films. The method is based on indentation with spherical indenters in the elastic-plastic transition regime. Experiments were performed on 7 μm copper films and 5 μm chromium films deposited on (100) silicon substrates using indenters with radii of 30, 69 and 122 μm. The biaxial stresses in the films, which were controlled by processing, were verified by X-ray techniques. Nanoindentation measurement of the film stresses proved difficult due to practical considerations arising from surface roughness, substrate effects and problems in producing an appropriate reference specimen for comparison. Finite element simulations showed that the substrate problems can be alleviated by using an indenter with a radius of the order of (or smaller than) the film thickness. However, the other difficulties pose serious obstacles to the practical implementation of the method to thin film residual stress measurement.

KW - Chromium

KW - Copper

KW - Nanoindentation

KW - Stress

UR - http://www.scopus.com/inward/record.url?scp=1342344895&partnerID=8YFLogxK

U2 - 10.1016/S0040-6090(03)01103-9

DO - 10.1016/S0040-6090(03)01103-9

M3 - Conference article

AN - SCOPUS:1342344895

SN - 0040-6090

VL - 447-448

SP - 251

EP - 257

JO - Thin Solid Films

JF - Thin Solid Films

T2 - Proceedings of the 30th International Conference on Metallurgie

Y2 - 28 April 2002 through 2 May 2002

ER -

Factors limiting the measurement of residual stresses in thin films by nanoindentation

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