TY - JOUR
T1 - Exploring the limits of low cost, organics-compatible high-k ceramic thin-films for embedded decoupling applications
AU - Balaraman, Devarajan
AU - Raj, P. M.
AU - Abothu, Robin
AU - Bhattacharya, S.
AU - Sacks, Michael
AU - Lance, Michael
AU - Meyer, Harry
AU - Swaminathan, Madhavan
AU - Tummala, Rao
PY - 2005
Y1 - 2005
N2 - This paper presents four organic-compatible thin film processing techniques for embedding capacitors into organic PWBs. Hydrothermal synthesis allows integration of pure nano-grained barium titanate films with capacitance density of about 1 μF/cm 2. Sol-gel and RF-sputtering in conjunction with a foil transfer process can be used to integrate a variety of perovskite thin films with the capacitance in the range of 200-400 nF/cm 2. Thermal oxidation of titanium foil also emerges as a viable process for integrating capacitance of 100s of nF using a foil transfer process. The dielectric properties of the films synthesized by these techniques as a function of various process parameters are presented. Observed dielectric properties like dielectric constant, leakage current and breakdown strengths have been correlated to structural defects and stoichiometry of the films.
AB - This paper presents four organic-compatible thin film processing techniques for embedding capacitors into organic PWBs. Hydrothermal synthesis allows integration of pure nano-grained barium titanate films with capacitance density of about 1 μF/cm 2. Sol-gel and RF-sputtering in conjunction with a foil transfer process can be used to integrate a variety of perovskite thin films with the capacitance in the range of 200-400 nF/cm 2. Thermal oxidation of titanium foil also emerges as a viable process for integrating capacitance of 100s of nF using a foil transfer process. The dielectric properties of the films synthesized by these techniques as a function of various process parameters are presented. Observed dielectric properties like dielectric constant, leakage current and breakdown strengths have been correlated to structural defects and stoichiometry of the films.
UR - http://www.scopus.com/inward/record.url?scp=24644462435&partnerID=8YFLogxK
M3 - Conference article
AN - SCOPUS:24644462435
SN - 0569-5503
VL - 2
SP - 1215
EP - 1221
JO - Proceedings - Electronic Components and Technology Conference
JF - Proceedings - Electronic Components and Technology Conference
T2 - 55th Electronic Components and Technology Conference, ECTC
Y2 - 31 May 2005 through 4 June 2005
ER -