EXPERIMENTAL ANALYSIS OF SINGLE EVAPORATION TUBE UTILIZING SINTERED COPPER PARTICLE WICKING STRUCTURES

Jeremy Spitzenberger, James Hoelle, Ramy H. Mohammed, Laith Ismael, Hongbin Ma, Pengtao Wang, Stephen Kowalski, Kashif Nawaz

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Wicking structures have been widely used within passive heat transfer devices with high heat fluxes, such as heat pipes, to enhance their thermal performance. While wicking structures promote capillary pumping of the working fluid as well as thin film evaporation, they can result in capillary evaporation and further enhances the evaporation heat transfer. In this study, a 0.5 mm thick layer of 105 μm sintered copper particles was added to the inner wall of a copper tube, aiming to enhance the heat transfer characteristics by taking advantage of capillary evaporation. Acetone was chosen as the working fluid, and the performance of an evaporation tube was tested for power inputs of 10, 30, 50, and 70 W. For each power input, trials were run at inclination angle varying from -90° and 90° to investigate the capillary effects. The temperature measurements showed that the temperature distribution along the evaporation tube is always downward sloping, meaning the temperature at the fluid inlet is larger than the outlet. Interestingly, the surface temperature at some locations is less than the outlet temperature, indicating the effect of capillary evaporation. In addition, a theoretical investigation was performed to investigate the effects of the particle size on the thermal performance of the evaporation tube and found that particle sizes affect capillary evaporation.

Original languageEnglish
Title of host publicationProceedings of ASME 2023 Heat Transfer Summer Conference, HT 2023
PublisherAmerican Society of Mechanical Engineers (ASME)
ISBN (Electronic)9780791887165
DOIs
StatePublished - 2023
EventASME 2023 Heat Transfer Summer Conference, HT 2023 - Washington, United States
Duration: Jul 10 2023Jul 12 2023

Publication series

NameProceedings of ASME 2023 Heat Transfer Summer Conference, HT 2023

Conference

ConferenceASME 2023 Heat Transfer Summer Conference, HT 2023
Country/TerritoryUnited States
CityWashington
Period07/10/2307/12/23

Funding

This material is based upon work supported by the U.S. Department of Energy, Office of Science, Building Technologies Office. This research used resources of the Building Technologies Research and Integration Center (BTRIC) of the Oak Ridge National Laboratory, which is a DOE Office of Science User Facility.

Keywords

  • copper sintered particles
  • evaporation
  • heat transfer

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