ExaCA v2.0: A versatile, scalable, and performance portable cellular automata application for additive manufacturing solidification

Matt Rolchigo, Samuel Temple Reeve, Benjamin Stump, John Coleman, Alex Plotkowski

Research output: Contribution to journalArticlepeer-review

Abstract

The previously established ExaCA software for performance portable alloy grain structure simulation has been updated to better represent the solidification behavior during complex alloy processing conditions, such as those encountered during metal additive manufacturing (AM), and for improved performance and scalability. An extension to the time–temperature history input data format and the core ExaCA algorithm to include an arbitrary number of melting and solidification events yielded improved prediction of texture for various melt pool geometries, expanding the range of AM-relevant conditions that can be accurately simulated. Improved heat transport process simulation coupling, including the creation of large raster datasets from single track time–temperature history data and in-memory coupling with the new, performance portable finite difference code Finch, were also demonstrated in example studies on the effect of multilayer AM microstructure predictions on hatch spacing and cell size, respectively. Additional new features are detailed and demonstrated, including the ability to perform simulations using various interfacial response function forms, execute simulations on state-of-the-art hardware, improved usability through post-processing versatility, and improved strong and weak scaling performance. The performance, physics, and versatility improvements demonstrated here will further enable large-scale studies on AM process–microstructure relationships that were not previously possible. Furthermore, the usability improvements and ability to run coupled AM process–microstructure simulations using the Finch-ExaCA workflow will facilitate broader use of this open-source software by the computational materials community.

Original languageEnglish
Article number113734
JournalComputational Materials Science
Volume251
DOIs
StatePublished - Mar 2025

Funding

Research was performed at the U.S. Department of Energy's Manufacturing Demonstration Facility, located at Oak Ridge National Laboratory. This manuscript has been authored by UT-Battelle, LLC under Contract No. DE-AC05-00OR22725 with the U.S. Department of Energy. Research was co-sponsored by the U.S. Department of Energy Office of Energy Efficiency and Renewable Energy, Advanced Materials and Manufacturing Technologies Office and by the Exascale Computing Project (17-SC-20-SC), a collaborative effort of the U.S. DOE Office of Science and the NNSA . The United States Government retains and the publisher, by accepting the article for publication, acknowledges that the United States Government retains a non-exclusive, paid-up, irrevocable, world-wide license to publish or reproduce the published form of this manuscript, or allow others to do so, for United States Government purposes. The Department of Energy will provide public access to these results of federally sponsored research in accordance with the DOE Public Access Plan (http://energy.gov/downloads/doe-public-access-plan). This research used resources of the Oak Ridge Leadership Computing Facility at the Oak Ridge National Laboratory, which is supported by the Office of Science of the U.S. Department of Energy under Contract No. DE-AC05-00OR22725. This research also used resources of the Argonne Leadership Computing Facility, a U.S. Department of Energy (DOE) Office of Science user facility at Argonne National Laboratory and is based on research supported by the U.S. DOE Office of Science-Advanced Scientific Computing Research Program, under Contract No. DE-AC02-06CH11357. This research used resources of the Oak Ridge Leadership Computing Facility at the Oak Ridge National Laboratory, which is supported by the Office of Science of the U.S. Department of Energy under Contract No. DE-AC05-00OR22725. This research also used resources of the Argonne Leadership Computing Facility, a U.S. Department of Energy (DOE) Office of Science user facility at Argonne National Laboratory and is based on research supported by the U.S. DOE Office of Science-Advanced Scientific Computing Research Program, under Contract No. DE-AC02-06CH11357. Research was performed at the U.S. Department of Energy\u2019s Manufacturing Demonstration Facility, located at Oak Ridge National Laboratory. This manuscript has been authored by UT-Battelle, LLC under Contract No. DE-AC05-00OR22725 with the U.S. Department of Energy. Research was co-sponsored by the U.S. Department of Energy Office of Energy Efficiency and Renewable Energy, Advanced Materials and Manufacturing Technologies Office and by the Exascale Computing Project ( 17-SC-20-SC ), a collaborative effort of the U.S. DOE Office of Science and the NNSA .

Keywords

  • Additive manufacturing
  • Alloy solidification
  • High performance computing
  • Microstructure

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