ExaAM: Metal additive manufacturing simulation at the fidelity of the microstructure

John A. Turner, James Belak, Nathan Barton, Matthew Bement, Neil Carlson, Robert Carson, Stephen DeWitt, Jean Luc Fattebert, Neil Hodge, Zechariah Jibben, Wayne King, Lyle Levine, Christopher Newman, Alex Plotkowski, Balasubramaniam Radhakrishnan, Samuel Temple Reeve, Matthew Rolchigo, Adrian Sabau, Stuart Slattery, Benjamin Stump

Research output: Contribution to journalArticlepeer-review

25 Scopus citations

Abstract

Additive manufacturing (AM), or 3D printing, of metals is transforming the fabrication of components, in part by dramatically expanding the design space, allowing optimization of shape and topology. However, although the physical processes involved in AM are similar to those of welding, a field with decades of experimental, modeling, simulation, and characterization experience, qualification of AM parts remains a challenge. The availability of exascale computational systems, particularly when combined with data-driven approaches such as machine learning, enables topology and shape optimization as well as accelerated qualification by providing process-aware, locally accurate microstructure and mechanical property models. We describe the physics components comprising the Exascale Additive Manufacturing simulation environment and report progress using highly resolved melt pool simulations to inform part-scale finite element thermomechanics simulations, drive microstructure evolution, and determine constitutive mechanical property relationships based on those microstructures using polycrystal plasticity. We report on implementation of these components for exascale computing architectures, as well as the multi-stage simulation workflow that provides a unique high-fidelity model of process–structure–property relationships for AM parts. In addition, we discuss verification and validation through collaboration with efforts such as AM-Bench, a set of benchmark test problems under development by a team led by the National Institute of Standards and Technology.

Original languageEnglish
Pages (from-to)13-39
Number of pages27
JournalInternational Journal of High Performance Computing Applications
Volume36
Issue number1
DOIs
StatePublished - Jan 2022

Funding

This manuscript has been authored by UT-Battelle, LLC under Contract No. DE-AC05-00OR22725 with the U.S. Department of Energy (DOE). The publisher, by accepting the article for publication, acknowledges that the United States Government retains a non-exclusive, paid-up, irrevocable, world-wide license to publish or reproduce the published form of this manuscript, or allow others to do so, for United States Government purposes. The DOE will provide public access to these results of federally sponsored research in accordance with the DOE Public Access Plan. 23 This research used resources of the Oak Ridge Leadership Computing Facility at the Oak Ridge National Laboratory (ORNL), which is supported by the Office of Science of the DOE under the same contract. This research was supported by the Exascale Computing Project (17-SC-20-SC), a collaborative effort of the DOE Office of Science and the National Nuclear Security Administration (NNSA). The work of LANL, LLNL, and ORNL authors was performed for the DOE through Triad National Security, LLC (Contract No. 89233218CNA000001), Lawrence Livermore National Security, LLC (Contract No. DEAC52-07NA27344), and UT-Battelle, LLC (Contract No. DE-AC05-00OR22725), respectively. The author(s) disclosed receipt of the following financial support for the research, authorship, and/or publication of this article: This article is financially supported by Office of Science (17-SC-20-SC). This manuscript has been authored by UT-Battelle, LLC under Contract No. DE-AC05-00OR22725 with the U.S. Department of Energy (DOE). The publisher, by accepting the article for publication, acknowledges that the United States Government retains a non-exclusive, paid-up, irrevocable, world-wide license to publish or reproduce the published form of this manuscript, or allow others to do so, for United States Government purposes. The DOE will provide public access to these results of federally sponsored research in accordance with the DOE Public Access Plan. This research used resources of the Oak Ridge Leadership Computing Facility at the Oak Ridge National Laboratory (ORNL), which is supported by the Office of Science of the DOE under the same contract. This research was supported by the Exascale Computing Project (17-SC-20-SC), a collaborative effort of the DOE Office of Science and the National Nuclear Security Administration (NNSA). The work of LANL, LLNL, and ORNL authors was performed for the DOE through Triad National Security, LLC (Contract No. 89233218CNA000001), Lawrence Livermore National Security, LLC (Contract No. DEAC52-07NA27344), and UT-Battelle, LLC (Contract No. DE-AC05-00OR22725), respectively. The author(s) disclosed receipt of the following financial support for the research, authorship, and/or publication of this article: This article is financially supported by Office of Science (17-SC-20-SC).

Keywords

  • 3D printing
  • coupled physics
  • metal additive manufacturing
  • microstructure
  • multiscale materials

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