Energy Efficiency Scaling for 2 Decades (EES2) Roadmap for Computing

T. Kaarsberg, J. Atulasimha, J. Baniecki, P. Fischer, S. Pawlowski, S. Misra, A. Bhavnagarwala, E. Salman, M. Ahmed, N. Li, R. Aggarwal, B. Hirano, T. Shah, C. Green, J. Booth, P. Sharps, T. McDonald, J. Ballard, Y. Chen, P. NagapurkarW. Huang, D. Kudithipudi, A. Paramonov, F. Musso, A. K. Ziabari, J. Luo, A. K. Petford-Long, D. Gopman, C. Gotama, T. Wei, S. Shaheen, Y. Zhang, I. Lu, K. Shimizu, E. Taylor, N. Johnson, R. Jones, S. Shankar

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In response to the looming crisis in global energy consumption required for advanced computing applications, the United States Department of Energy (DOE) Advanced Materials and Manufacturing Technology Office (AMMTO) is leading a multi-organizational effort to define a roadmap for energy efficiency scaling for two decades (EES2) with the aim to reduce energy use in all aspects of computation by more than a factor of 1000 in two decades. By July of 2024, over 60 organizations representing industry, academia, and the national laboratories have pledged to work in various aspects of research and development to enable energy efficiency in computing including in the development of the EES2 roadmap, with an initial public release in 2024 as the first phase of an ongoing commitment to energy-efficient and sustainable computation.

Original languageEnglish
Title of host publication2024 IEEE High Performance Extreme Computing Conference, HPEC 2024
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798350387131
DOIs
StatePublished - 2024
Event2024 IEEE High Performance Extreme Computing Conference, HPEC 2024 - Virtual, Online
Duration: Sep 23 2024Sep 27 2024

Publication series

Name2024 IEEE High Performance Extreme Computing Conference, HPEC 2024

Conference

Conference2024 IEEE High Performance Extreme Computing Conference, HPEC 2024
CityVirtual, Online
Period09/23/2409/27/24

Funding

This manuscript has been authored by UT-Battelle, LLC, under contract DE-AC05-00OR22725 with the US Department of Energy (DOE). The work is supported by Argonne National Laboratory, a U. S. Department of Energy (DoE), Office of Science, Office of Basic Energy Sciences, under DoE contract number DE-AC02-06CH11357. SLAC National Accelerator Laboratory is managed and operated by Stanford University under DOE contract DEAC02- 76SF00515. Sandia National Laboratories is managed and operated by NTESS under DOE NNSA contract DENA0003525. Nantero is the inventor and manufacturer of the Carbon-Nano-tube memory (NRAM) BRDG bridge to connect is a nonprofit organization serving first-in-family STEM college students.

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