Abstract
The power module for high-power electronics is designed to accommodate semiconductor dies and provide the electrical connection and isolation to and from other components, the extraction and transfer of generated heat in the dies, and protection from environmental conditions (e.g., dust and humidity). The illustration of a conventional power module cross section is presented in Figure 13.1 in which various structure components are highlighted. The structure comprises different materials, such as Al for bond wire, Cu for electrical terminals, and AlN for ceramic-based direct-bonded Cu (DBC) substrate. This multilayer, multimaterial-based structure has limited heat extraction capabilities. Furthermore, certain layers of the structure shown in Figure 13.1 are subject to high mechanical stress due to different coefficients of thermal expansion (CTE) between layers during module power and environmental cycling, thus leading to limited lifetime and early failures caused by thermal stress [1]. This chapter discusses some of the emerging technologies for wide bandgap power modules-including high-performance heat spreaders and substrates-and 3D printed heat sinks.
| Original language | English |
|---|---|
| Title of host publication | SiC Power Module Design |
| Subtitle of host publication | Performance, Robustness and Reliability |
| Publisher | Institution of Engineering and Technology |
| Pages | 313-332 |
| Number of pages | 20 |
| ISBN (Electronic) | 9781785619076 |
| ISBN (Print) | 9781785619083 |
| State | Published - Jan 1 2021 |