Electromigration-Aware Reliability Optimization of MCPM Layouts Using PowerSynth

Imam Al Razi; Whit Vinson; David R. Huitink; Yarui Peng

doi:10.1109/ECCE50734.2022.9947555

Electromigration-Aware Reliability Optimization of MCPM Layouts Using PowerSynth

Imam Al Razi
, Whit Vinson
, David R. Huitink
, Yarui Peng

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

4 Scopus citations

Abstract

Modern power electronics are experiencing significant demand for ultra-high-power density in the grid, data center, automotive industries, and aerospace applications. To satisfy the increasing demand, innovative packaging technologies for multi-chip power modules (MCPMs) are proposed by leveraging the advantages from wide bandgap (WBG) devices (i.e., SiC, GaN). Since higher density modules are more vulnerable to electromigration (EM) risk, the MCPM layout optimization requires EM consideration along with electro-thermal aspects. In this paper, an EM-aware reliability optimization methodology is proposed and implemented in PowerSynth. Mean time to failure (MTTF) is used as the reliability metric for EM risk assessment. MTTF estimation needs a detailed current density and temperature distribution in a relatively fast method that can be used in an optimization loop. Our approach has shown 1,100 times speedup in current density extraction compared to the FEM simulation. MCPM with wire bonding and solder bump arrays are optimized using the proposed workflow. Experimental results are used to predict MTTF for wire-bonded module case.

Original language	English
Title of host publication	2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781728193878
DOIs	https://doi.org/10.1109/ECCE50734.2022.9947555
State	Published - 2022
Externally published	Yes
Event	2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022 - Detroit, United States Duration: Oct 9 2022 → Oct 13 2022

Publication series

Name	2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022

Conference

Conference	2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022
Country/Territory	United States
City	Detroit
Period	10/9/22 → 10/13/22

Funding

This material is based on work supported by The National Science Foundation under Grant No. EEC-1449548. Any opinions, findings, and conclusions or recommendations expressed in this material are those of the author(s) and do not reflect the views of the National Science Foundation.

Keywords

ElectroMigration (EM)
Layout Optimization
PowerSynth 2
Reliability Optimization

Access to Document

10.1109/ECCE50734.2022.9947555

Cite this

Al Razi, I., Vinson, W., Huitink, D. R., & Peng, Y. (2022). Electromigration-Aware Reliability Optimization of MCPM Layouts Using PowerSynth. In 2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022 (2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECCE50734.2022.9947555

@inproceedings{24cf487f75d743e39ae59c691f99aaaa,

title = "Electromigration-Aware Reliability Optimization of MCPM Layouts Using PowerSynth",

abstract = "Modern power electronics are experiencing significant demand for ultra-high-power density in the grid, data center, automotive industries, and aerospace applications. To satisfy the increasing demand, innovative packaging technologies for multi-chip power modules (MCPMs) are proposed by leveraging the advantages from wide bandgap (WBG) devices (i.e., SiC, GaN). Since higher density modules are more vulnerable to electromigration (EM) risk, the MCPM layout optimization requires EM consideration along with electro-thermal aspects. In this paper, an EM-aware reliability optimization methodology is proposed and implemented in PowerSynth. Mean time to failure (MTTF) is used as the reliability metric for EM risk assessment. MTTF estimation needs a detailed current density and temperature distribution in a relatively fast method that can be used in an optimization loop. Our approach has shown 1,100 times speedup in current density extraction compared to the FEM simulation. MCPM with wire bonding and solder bump arrays are optimized using the proposed workflow. Experimental results are used to predict MTTF for wire-bonded module case.",

keywords = "ElectroMigration (EM), Layout Optimization, PowerSynth 2, Reliability Optimization",

author = "\{Al Razi\}, Imam and Whit Vinson and Huitink, \{David R.\} and Yarui Peng",

note = "Publisher Copyright: {\textcopyright} 2022 IEEE.; 2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022 ; Conference date: 09-10-2022 Through 13-10-2022",

year = "2022",

doi = "10.1109/ECCE50734.2022.9947555",

language = "English",

series = "2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022",

}

Al Razi, I, Vinson, W, Huitink, DR & Peng, Y 2022, Electromigration-Aware Reliability Optimization of MCPM Layouts Using PowerSynth. in 2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022. 2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022, Institute of Electrical and Electronics Engineers Inc., 2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022, Detroit, United States, 10/9/22. https://doi.org/10.1109/ECCE50734.2022.9947555

Electromigration-Aware Reliability Optimization of MCPM Layouts Using PowerSynth. / Al Razi, Imam; Vinson, Whit; Huitink, David R. et al.
2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022. Institute of Electrical and Electronics Engineers Inc., 2022. (2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Electromigration-Aware Reliability Optimization of MCPM Layouts Using PowerSynth

AU - Al Razi, Imam

AU - Vinson, Whit

AU - Huitink, David R.

AU - Peng, Yarui

PY - 2022

Y1 - 2022

N2 - Modern power electronics are experiencing significant demand for ultra-high-power density in the grid, data center, automotive industries, and aerospace applications. To satisfy the increasing demand, innovative packaging technologies for multi-chip power modules (MCPMs) are proposed by leveraging the advantages from wide bandgap (WBG) devices (i.e., SiC, GaN). Since higher density modules are more vulnerable to electromigration (EM) risk, the MCPM layout optimization requires EM consideration along with electro-thermal aspects. In this paper, an EM-aware reliability optimization methodology is proposed and implemented in PowerSynth. Mean time to failure (MTTF) is used as the reliability metric for EM risk assessment. MTTF estimation needs a detailed current density and temperature distribution in a relatively fast method that can be used in an optimization loop. Our approach has shown 1,100 times speedup in current density extraction compared to the FEM simulation. MCPM with wire bonding and solder bump arrays are optimized using the proposed workflow. Experimental results are used to predict MTTF for wire-bonded module case.

AB - Modern power electronics are experiencing significant demand for ultra-high-power density in the grid, data center, automotive industries, and aerospace applications. To satisfy the increasing demand, innovative packaging technologies for multi-chip power modules (MCPMs) are proposed by leveraging the advantages from wide bandgap (WBG) devices (i.e., SiC, GaN). Since higher density modules are more vulnerable to electromigration (EM) risk, the MCPM layout optimization requires EM consideration along with electro-thermal aspects. In this paper, an EM-aware reliability optimization methodology is proposed and implemented in PowerSynth. Mean time to failure (MTTF) is used as the reliability metric for EM risk assessment. MTTF estimation needs a detailed current density and temperature distribution in a relatively fast method that can be used in an optimization loop. Our approach has shown 1,100 times speedup in current density extraction compared to the FEM simulation. MCPM with wire bonding and solder bump arrays are optimized using the proposed workflow. Experimental results are used to predict MTTF for wire-bonded module case.

KW - ElectroMigration (EM)

KW - Layout Optimization

KW - PowerSynth 2

KW - Reliability Optimization

UR - https://www.scopus.com/pages/publications/85144087408

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DO - 10.1109/ECCE50734.2022.9947555

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BT - 2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022

Y2 - 9 October 2022 through 13 October 2022

ER -

Electromigration-Aware Reliability Optimization of MCPM Layouts Using PowerSynth

Abstract

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Keywords

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