TY - JOUR
T1 - Electrochemical deposition of bismuth micro- and nanowires using electroplate and lift lithography
AU - Hohl, Timea
AU - Lepak, Lori A.
AU - Zimmerman, Andrew
AU - Hempel, Samuel
AU - Sumant, Anirudha V.
AU - Divan, Ralu
AU - Miller, C. Suzanne
AU - Rosenmann, Daniel
AU - Verzani, Christopher
AU - Tákacs, Endre
AU - Zach, Michael P.
N1 - Publisher Copyright:
© 2012 Materials Research Society.
PY - 2012
Y1 - 2012
N2 - Patterned micro- and nanowires of several compositions in the solution series of BixTey were electrochemically deposited using Electroplate and Lift (E&L) Lithography on Ultrananocrystalline Diamond (UNCD) templates. The composition of the deposited BixTey wires was controlled by mixing saturated solutions of bismuth nitrate and tellurium in various ratios in the electroplating bath. All wires were electroplated via pulsed depositions at -1.4V vs. the saturated calomel electrode (SCE). The morphology and composition of all wires were studied by scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS). In general, the BixTey wires were fine-grained and brittle, often fracturing during the liftoff process. By contrast, wires containing less than 5% Te are smooth, and strong enough to support their own weight without a supporting medium for a length of over 100 times the wire diameter.
AB - Patterned micro- and nanowires of several compositions in the solution series of BixTey were electrochemically deposited using Electroplate and Lift (E&L) Lithography on Ultrananocrystalline Diamond (UNCD) templates. The composition of the deposited BixTey wires was controlled by mixing saturated solutions of bismuth nitrate and tellurium in various ratios in the electroplating bath. All wires were electroplated via pulsed depositions at -1.4V vs. the saturated calomel electrode (SCE). The morphology and composition of all wires were studied by scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS). In general, the BixTey wires were fine-grained and brittle, often fracturing during the liftoff process. By contrast, wires containing less than 5% Te are smooth, and strong enough to support their own weight without a supporting medium for a length of over 100 times the wire diameter.
UR - http://www.scopus.com/inward/record.url?scp=84938326508&partnerID=8YFLogxK
U2 - 10.1557/opl.2012.1723
DO - 10.1557/opl.2012.1723
M3 - Conference article
AN - SCOPUS:84938326508
SN - 0272-9172
VL - 1477
SP - 1
EP - 6
JO - Materials Research Society Symposium Proceedings
JF - Materials Research Society Symposium Proceedings
IS - January
T2 - 21st International Materials Research Congress, IMRC 2012
Y2 - 12 August 2012 through 17 August 2012
ER -