Electrochemical deposition of bismuth micro- and nanowires using electroplate and lift lithography

Timea Hohl, Lori A. Lepak, Andrew Zimmerman, Samuel Hempel, Anirudha V. Sumant, Ralu Divan, C. Suzanne Miller, Daniel Rosenmann, Christopher Verzani, Endre Tákacs, Michael P. Zach

Research output: Contribution to journalConference articlepeer-review

Abstract

Patterned micro- and nanowires of several compositions in the solution series of BixTey were electrochemically deposited using Electroplate and Lift (E&L) Lithography on Ultrananocrystalline Diamond (UNCD) templates. The composition of the deposited BixTey wires was controlled by mixing saturated solutions of bismuth nitrate and tellurium in various ratios in the electroplating bath. All wires were electroplated via pulsed depositions at -1.4V vs. the saturated calomel electrode (SCE). The morphology and composition of all wires were studied by scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS). In general, the BixTey wires were fine-grained and brittle, often fracturing during the liftoff process. By contrast, wires containing less than 5% Te are smooth, and strong enough to support their own weight without a supporting medium for a length of over 100 times the wire diameter.

Original languageEnglish
Pages (from-to)1-6
Number of pages6
JournalMaterials Research Society Symposium Proceedings
Volume1477
Issue numberJanuary
DOIs
StatePublished - 2012
Externally publishedYes
Event21st International Materials Research Congress, IMRC 2012 - Cancun, Mexico
Duration: Aug 12 2012Aug 17 2012

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