Electro-Thermal Optimization of Common-Mode Screen for Organic Substrate-Based SiC Power Module

Narayanan Rajagopal; Emre Gurpinar; Burak Ozpineci; Christina DiMarino

doi:10.1109/ECCE50734.2022.9947771

Electro-Thermal Optimization of Common-Mode Screen for Organic Substrate-Based SiC Power Module

Narayanan Rajagopal
, Emre Gurpinar
, Burak Ozpineci
, Christina DiMarino

Buildings and Transportation Science Div

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

9 Scopus citations

Abstract

The past few years have seen organic substrates become a popular alternative to ceramics substrates for power modules. The design flexibility of organic substrates allows for a high level of integration with the cooling system and gate driver circuitry. Although organic substrates have many benefits, the intrinsic features of the thin dielectric cause thermal and common-mode (CM) current issues. This work aims to address these concerns by modeling and optimizing multi-layer organic substrates for a wirebond-less 1.7 kV SiC MOSFET power module. The geometry and layout are optimized to minimize the module's maximum temperature and high capacitive coupling to the baseplate. The simulation and optimization of multi-layer organic substrate design enable a 30 dB reduction in CM noise while achieving a maximum temperature of less than 175 °C.

Original language	English
Title of host publication	2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781728193878
DOIs	https://doi.org/10.1109/ECCE50734.2022.9947771
State	Published - 2022
Event	2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022 - Detroit, United States Duration: Oct 9 2022 → Oct 13 2022

Publication series

Name	2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022

Conference

Conference	2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022
Country/Territory	United States
City	Detroit
Period	10/9/22 → 10/13/22

Funding

The authors acknowledge the financial support provided by the U.S. Department of Energy Advanced Manufacturing Office through the Wide Bandgap Generation (WBGen) Fellowship at the Center for Power Electronics Systems (CPES) at Virginia Tech (http://www.eng.vt.edu/WBGen). The U.S. government retains and the publisher, by accepting the article for publication, acknowledges that the U.S. government retains a nonexclusive, paid-up, irrevocable, worldwide license to publish or reproduce the published form of this manuscript, or allow others to do so, for U.S. government purposes. DOE will provide public access to these results of federally sponsored research in accordance with the DOE Public Access Plan (http://energy.gov/downloads/doe-public-access-plan). The authors acknowledge the financial support provided by the U.S. Department of Energy Advanced Manufacturing Office through the Wide Bandgap Generation (WBGen) Fellowship at the Center for Power Electronics Systems (CPES) at Virginia Tech (http://www.eng.vt.edu/WBGen).

Keywords

EMC
EMI
Packaging
SiC
organic
substrate

Access to Document

10.1109/ECCE50734.2022.9947771

Cite this

Rajagopal, N., Gurpinar, E., Ozpineci, B., & DiMarino, C. (2022). Electro-Thermal Optimization of Common-Mode Screen for Organic Substrate-Based SiC Power Module. In 2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022 (2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECCE50734.2022.9947771

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title = "Electro-Thermal Optimization of Common-Mode Screen for Organic Substrate-Based SiC Power Module",

abstract = "The past few years have seen organic substrates become a popular alternative to ceramics substrates for power modules. The design flexibility of organic substrates allows for a high level of integration with the cooling system and gate driver circuitry. Although organic substrates have many benefits, the intrinsic features of the thin dielectric cause thermal and common-mode (CM) current issues. This work aims to address these concerns by modeling and optimizing multi-layer organic substrates for a wirebond-less 1.7 kV SiC MOSFET power module. The geometry and layout are optimized to minimize the module's maximum temperature and high capacitive coupling to the baseplate. The simulation and optimization of multi-layer organic substrate design enable a 30 dB reduction in CM noise while achieving a maximum temperature of less than 175 °C.",

keywords = "EMC, EMI, Packaging, SiC, organic, substrate",

author = "Narayanan Rajagopal and Emre Gurpinar and Burak Ozpineci and Christina DiMarino",

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year = "2022",

doi = "10.1109/ECCE50734.2022.9947771",

language = "English",

series = "2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022",

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Rajagopal, N, Gurpinar, E, Ozpineci, B & DiMarino, C 2022, Electro-Thermal Optimization of Common-Mode Screen for Organic Substrate-Based SiC Power Module. in 2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022. 2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022, Institute of Electrical and Electronics Engineers Inc., 2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022, Detroit, United States, 10/9/22. https://doi.org/10.1109/ECCE50734.2022.9947771

Electro-Thermal Optimization of Common-Mode Screen for Organic Substrate-Based SiC Power Module. / Rajagopal, Narayanan; Gurpinar, Emre; Ozpineci, Burak et al.
2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022. Institute of Electrical and Electronics Engineers Inc., 2022. (2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Electro-Thermal Optimization of Common-Mode Screen for Organic Substrate-Based SiC Power Module

AU - Rajagopal, Narayanan

AU - Gurpinar, Emre

AU - Ozpineci, Burak

AU - DiMarino, Christina

PY - 2022

Y1 - 2022

N2 - The past few years have seen organic substrates become a popular alternative to ceramics substrates for power modules. The design flexibility of organic substrates allows for a high level of integration with the cooling system and gate driver circuitry. Although organic substrates have many benefits, the intrinsic features of the thin dielectric cause thermal and common-mode (CM) current issues. This work aims to address these concerns by modeling and optimizing multi-layer organic substrates for a wirebond-less 1.7 kV SiC MOSFET power module. The geometry and layout are optimized to minimize the module's maximum temperature and high capacitive coupling to the baseplate. The simulation and optimization of multi-layer organic substrate design enable a 30 dB reduction in CM noise while achieving a maximum temperature of less than 175 °C.

AB - The past few years have seen organic substrates become a popular alternative to ceramics substrates for power modules. The design flexibility of organic substrates allows for a high level of integration with the cooling system and gate driver circuitry. Although organic substrates have many benefits, the intrinsic features of the thin dielectric cause thermal and common-mode (CM) current issues. This work aims to address these concerns by modeling and optimizing multi-layer organic substrates for a wirebond-less 1.7 kV SiC MOSFET power module. The geometry and layout are optimized to minimize the module's maximum temperature and high capacitive coupling to the baseplate. The simulation and optimization of multi-layer organic substrate design enable a 30 dB reduction in CM noise while achieving a maximum temperature of less than 175 °C.

KW - EMC

KW - EMI

KW - Packaging

KW - SiC

KW - organic

KW - substrate

UR - https://www.scopus.com/pages/publications/85144087654

U2 - 10.1109/ECCE50734.2022.9947771

DO - 10.1109/ECCE50734.2022.9947771

M3 - Conference contribution

AN - SCOPUS:85144087654

T3 - 2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022

BT - 2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022

Y2 - 9 October 2022 through 13 October 2022

ER -

Rajagopal N, Gurpinar E, Ozpineci B, DiMarino C. Electro-Thermal Optimization of Common-Mode Screen for Organic Substrate-Based SiC Power Module. In 2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022. Institute of Electrical and Electronics Engineers Inc. 2022. (2022 IEEE Energy Conversion Congress and Exposition, ECCE 2022). doi: 10.1109/ECCE50734.2022.9947771

Electro-Thermal Optimization of Common-Mode Screen for Organic Substrate-Based SiC Power Module

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Keywords

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