Abstract
The critical degradation voltage of AlGaN/GaN high-electron mobility transistors during off-state electrical stress was determined as a function of Ni/Au gate dimensions (0.10.17 μ), drain bias voltage, and source/draingate contact distance. Devices with different gate lengths and gatedrain distances were found to exhibit the onset of degradation at different sourcedrain biases but similar electric field strengths, showing that the degradation mechanism is primarily field driven. The degradation field was calculated to be 1.8 MV/cm by Automatically Tuned Linear Algebra Software simulations. Transmission electron microscopy imaging showed creation of defects under the gate after dc stress.
Original language | English |
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Article number | 5678846 |
Pages (from-to) | 187-193 |
Number of pages | 7 |
Journal | IEEE Transactions on Device and Materials Reliability |
Volume | 11 |
Issue number | 1 |
DOIs | |
State | Published - Mar 2011 |
Externally published | Yes |
Funding
Manuscript received June 1, 2010; revised July 10, 2010, November 23, 2010, and December 16, 2010; accepted December 22, 2010. Date of publication January 6, 2011; date of current version March 9, 2011. This work was supported in part by the AFOSR MURI monitored by Kitt Reinhardt and in part by Arizona State University under AFRL Contract FA8650-08-C-1395 (monitored by C. Bozada, WPAFB).
Funders | Funder number |
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AFOSR MURI | |
Kitt Reinhardt | |
Air Force Research Laboratory | FA8650-08-C-1395 |
Arizona State University |
Keywords
- AlGaN
- GaN
- degradation
- high-electron mobility transistor (HEMT)