Effects of high-dosage focused electron-beam irradiation at energies ≤ 30 keV on graphene on SiO 2

J. D. Femi-Oyetoro, K. Yao, K. Roccapriore, P. A. Ecton, R. Tang, J. D. Jones, G. Verbeck, J. M. Perez

Research output: Contribution to journalArticlepeer-review

3 Scopus citations

Abstract

We investigate the effects of focused electron-beam irradiation on exfoliated graphene on SiO 2 substrates at energies of 1.5, 10 and 30 keV and dosage of 28.8 C/cm 2 . Our objective is to understand the mechanism by which wide-area low-energy electron irradiation thins such samples. We test a previously reported mechanism in which the incident electrons produce defects in the graphene, pass through the graphene, and dissociate oxygen from the SiO 2 underneath. The dissociated oxygen then reacts with graphene, etching it from below. We conclude that although oxygen may play a role in the etching, incident electrons at 1.5, 10 and 30 keV that pass through the graphene do not etch it. We propose wide-area irradiation may dissociate oxygen from the uncovered SiO 2 substrate surrounding the graphene and produce etching from above.

Original languageEnglish
Pages (from-to)325-330
Number of pages6
JournalApplied Surface Science
Volume469
DOIs
StatePublished - Mar 1 2019
Externally publishedYes

Keywords

  • Electron irradiation
  • Etching
  • Graphene

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