Abstract
We investigate the effects of focused electron-beam irradiation on exfoliated graphene on SiO 2 substrates at energies of 1.5, 10 and 30 keV and dosage of 28.8 C/cm 2 . Our objective is to understand the mechanism by which wide-area low-energy electron irradiation thins such samples. We test a previously reported mechanism in which the incident electrons produce defects in the graphene, pass through the graphene, and dissociate oxygen from the SiO 2 underneath. The dissociated oxygen then reacts with graphene, etching it from below. We conclude that although oxygen may play a role in the etching, incident electrons at 1.5, 10 and 30 keV that pass through the graphene do not etch it. We propose wide-area irradiation may dissociate oxygen from the uncovered SiO 2 substrate surrounding the graphene and produce etching from above.
Original language | English |
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Pages (from-to) | 325-330 |
Number of pages | 6 |
Journal | Applied Surface Science |
Volume | 469 |
DOIs | |
State | Published - Mar 1 2019 |
Externally published | Yes |
Keywords
- Electron irradiation
- Etching
- Graphene