Effect of yttrium doping in tungsten on sinterability and properties as a plasma-facing material

  • Guensik Min
  • , Yeonju Oh
  • , Hwangsun Kim
  • , Eunjoo Shin
  • , Ki Baek Roh
  • , Jeongseok Kim
  • , Nojun Kwak
  • , Yanghoo Kim
  • , Hyoung Chan Kim
  • , Gon Ho Kim
  • , Heung Nam Han

Research output: Contribution to journalArticlepeer-review

12 Scopus citations

Abstract

Y2O3 is extensively used to fabricate oxide-dispersion-strengthened tungsten to refine grain size, improve thermal stability, and increase high-temperature strength. However, excessive Y2O3 addition weakens the grain-boundary strength, which increases the ductile-to-brittle transition temperature. Therefore, in this study, a small amount of Y-rich precipitates was dispersed in a tungsten matrix through internal oxidation during spark plasma sintering. The phase, morphology, and size of the Y-rich precipitates in the sintered tungsten were characterized by transmission electron microscopy (TEM) and small-angle neutron scattering (SANS) analyses. Additionally, the effects of Y doping on sinterability, thermal stability, deuterium irradiation resistance, and mechanical properties were analyzed using Y-free pure tungsten specimens for comparison.

Original languageEnglish
Article number169961
JournalJournal of Alloys and Compounds
Volume953
DOIs
StatePublished - Aug 25 2023

Funding

This study was supported by National Research Foundation of Korea (NRF) grants funded by the Ministry of Science ( 2021R1A2C3005096 , 2019M3D1A1079215 and 1711139323 ) and the ITER Technology R&D Program . The research facilities at the Institute of Engineering Research at Seoul National University were also utilized for this study.

Keywords

  • Internal oxidation
  • Irradiation Resistance
  • Microstructure
  • Oxide dispersion strengthening
  • Spark Plasma Sintering
  • Tungsten

Fingerprint

Dive into the research topics of 'Effect of yttrium doping in tungsten on sinterability and properties as a plasma-facing material'. Together they form a unique fingerprint.

Cite this