Effect of ultra-low temperature treatments on the stress in aluminum metallization of silicon wafers

Engineering

• Metallizations 100%
• Room Temperature 100%
• Silicon Wafer 100%
• Cryogenic Temperature 100%
• Tensiles 60%
• Tensile Stress σ 20%
• Compressive Stress 20%
• Flow Stress 20%
• Ray Diffraction Technique 20%
• Stress Relaxation 20%
• Constant Time 20%
• Silicon Dioxide 20%

Material Science

• Aluminum 100%
• Silicon Wafer 100%
• Ultimate Tensile Strength 50%
• Diffraction Measurement 50%
• Stress Relaxation 50%
• Silicate Glass 50%
• Thermal Cycling 50%