Effect of thermal exposure on microstructural and mechanical characteristics of reaction sintered SiC based materials

S. P. Lee, J. O. Jin, J. K. Lee, B. H. Min, H. K. Yoon, J. S. Park, Y. Katoh, A. Kohyama

Research output: Contribution to conferencePaperpeer-review

Abstract

The microstructure and the mechanical properties of RS-SiC and RS-SiC f/SiC materials suffered from the thermal exposure have been investigated in conjunction with both the residual silicon content and the porosity. RS-SiC based materials have been fabricated using the complex matrix slurry with different composition ratios of SiC and C particles. The characterization of RS-SiC based materials was investigated by means of SEM, EDS and three point bending test. The room temperature strength of RS-SiC material, which depended on the content of residual silicon, largely decreased with the increase of the thermal exposure times, due to large amount of porosities. The strength of RS-SiCf/SiC composites also tended to decrease at the temperature higher than 1000°C.

Original languageEnglish
Pages267-276
Number of pages10
StatePublished - 2004
Externally publishedYes
EventAdvances in Ceramic Matrix Composites IX, Proceedings - Nashville, TN, United States
Duration: Apr 27 2003Apr 30 2003

Conference

ConferenceAdvances in Ceramic Matrix Composites IX, Proceedings
Country/TerritoryUnited States
CityNashville, TN
Period04/27/0304/30/03

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