Effect of strain path on texture and annealing microstructure development in bulk pure copper processed by simple shear

Mohammed Haouaoui, K. Ted Hartwig, E. Andrew Payzant

Research output: Contribution to journalArticlepeer-review

74 Scopus citations

Abstract

The objective of this study was to determine the effect of strain path on the annealing behavior and texture development of severely plastically deformed oxygen free high conductivity copper. The material was deformed via equal channel angular extrusion (ECAE) to strains of 4.6 following three routes (A, B and C). Nucleation sites after recrystallization heat treatment start in shear bands with subsequent growth in the direction of slip lines. Processing that causes intersection of shear planes creates more sites for nucleation and leads to a shifting of the recrystallization curve to lower temperatures. The texture after multipass processing via route A is found to be similar to a rolling texture. An intermediate rotation of the billet of ±90° during processing (route B) is found to produce a partial fiber texture. Route C processing leads to the formation of a sheet texture which is not eliminated when a reversal strain is applied.

Original languageEnglish
Pages (from-to)801-810
Number of pages10
JournalActa Materialia
Volume53
Issue number3
DOIs
StatePublished - Feb 2005
Externally publishedYes

Funding

The work reported was sponsored by the State of Texas Higher Education Coordinating Board andthe Assistant Secretary for Energy Efficiency and Renewable Energy, Office of FreedomCAR and Vehicle Technologies, as part of the High Temperature Materials Laboratory User Program, Oak Ridge National Laboratory, managed by UT-Battelle, LLC, for the U.S. Department of Energy under Contract No. DE-AC05-00OR22725.

Keywords

  • Copper
  • ECAE
  • Microhardness
  • Recrystallization
  • Texture

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