Abstract
The effects of source field plates on AlGaN/GaN high electron mobility transistor reliability under off-state stress conditions were investigated using step-stress cycling. The source field plate enhanced the drain breakdown voltage from 55 to 155 V and the critical voltage for off-state gate stress from 40 to 65 V, relative to devices without the field plate. Transmission electron microscopy was used to examine the degradation of the gate contacts. The presence of pits that appeared on both source and drain sides of the gate edges was attributed to the inverse piezoelectric effect. In addition, a thin oxide layer was observed between the Ni gate contact and the AlGaN layer, and both Ni and oxygen had diffused into the AlGaN layer. After step-stress cycling, additional threading dislocations were observed.
Original language | English |
---|---|
Article number | 032204 |
Journal | Journal of Vacuum Science and Technology B: Nanotechnology and Microelectronics |
Volume | 29 |
Issue number | 3 |
DOIs | |
State | Published - May 2011 |
Externally published | Yes |
Funding
The work performed at UF was supported by a (U.S.) AFOSR MURI monitored by Gregg Jessen and Kitt Reinhardt, and the work carried out at Arizona State University was supported by an AFRL Contract No. FA8650-08-C-1395 monitored by Chris Bozada. The authors also acknowledge the use of microscopy facilities in The John M. Cowley Center for High Resolution Electron Microscopy at Arizona State University
Funders | Funder number |
---|---|
Gregg Jessen and Kitt Reinhardt | |
Air Force Office of Scientific Research | |
Air Force Research Laboratory | FA8650-08-C-1395 |