Abstract
The diffusion-bonded Mg-Al joints with and without silver interlayer prepared by Magnetron Sputtering have been investigated. The addition of silver interlayers eliminated the formation of Mg-Al intermetallic compounds and improved the bonding strength of Mg-Al joints. Mg3Ag, MgAg and Ag-based solid solution were observed in the interface of Mg/Ag/Al joint. The microhardness value of the interface in Mg/Ag/Al joint with a maximum value 125 HV of Mg3Ag layer is much lower than that in Mg/Al joint with a maximum value 225 HV of Mg2Al3 layer. Fracture failure in Mg/Ag/Al joint occurred between Mg3Ag layer and MgAg layer. Transgranular fracture and plastic deformation observed on fracture surfaces of Mg/Ag/Al joint differ from cleavage fracture features of Mg/Al joint.
Original language | English |
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Pages (from-to) | 458-461 |
Number of pages | 4 |
Journal | Journal of Alloys and Compounds |
Volume | 541 |
DOIs | |
State | Published - Nov 15 2012 |
Externally published | Yes |
Funding
The authors gratefully acknowledge the sponsorship from the National Natural Science Foundation of China (No. 11072228 ) for the financial support.
Funders | Funder number |
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National Natural Science Foundation of China | 11072228 |
Keywords
- Al alloy
- Diffusion bonding
- Interfaces
- Magnetron Sputtering
- Mg alloy
- Silver interlayer