Effect of silver interlayer on microstructure and mechanical properties of diffusion-bonded Mg-Al joints

Yiyu Wang, Guoqiang Luo, Jian Zhang, Qiang Shen, Lianmeng Zhang

Research output: Contribution to journalLetterpeer-review

56 Scopus citations

Abstract

The diffusion-bonded Mg-Al joints with and without silver interlayer prepared by Magnetron Sputtering have been investigated. The addition of silver interlayers eliminated the formation of Mg-Al intermetallic compounds and improved the bonding strength of Mg-Al joints. Mg3Ag, MgAg and Ag-based solid solution were observed in the interface of Mg/Ag/Al joint. The microhardness value of the interface in Mg/Ag/Al joint with a maximum value 125 HV of Mg3Ag layer is much lower than that in Mg/Al joint with a maximum value 225 HV of Mg2Al3 layer. Fracture failure in Mg/Ag/Al joint occurred between Mg3Ag layer and MgAg layer. Transgranular fracture and plastic deformation observed on fracture surfaces of Mg/Ag/Al joint differ from cleavage fracture features of Mg/Al joint.

Original languageEnglish
Pages (from-to)458-461
Number of pages4
JournalJournal of Alloys and Compounds
Volume541
DOIs
StatePublished - Nov 15 2012
Externally publishedYes

Funding

The authors gratefully acknowledge the sponsorship from the National Natural Science Foundation of China (No. 11072228 ) for the financial support.

Keywords

  • Al alloy
  • Diffusion bonding
  • Interfaces
  • Magnetron Sputtering
  • Mg alloy
  • Silver interlayer

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