@inproceedings{fcae508ba49f4138af8c79a0a96aa05d,
title = "Effect of high temperature aging on microstructurual evolution in AuSn solder joints",
abstract = "Eutectic AuSn solder is increasingly used in high temperature and high reliability applications due to superior mechanical and thermal properties. These applications include hybrid microelectronics, MEMS, high power laser diodes, optoelectronic devices and components packaging. Selection of appropriate device backside and substrate surface metallization is critical for reliable soldering with AuSn, especially for high temperature application as diffusion accelerates at elevated temperature. A SiC die was used for die attach studies on thick film metalized ceramic substrates. Two thick film metallurgies (Au and PtPdAu) were evaluated. Aging and thermal cycling data are presented along with fracture surface analysis after high temperature storage.",
keywords = "AuSn solder, High temperature, Thick film",
author = "R. Zhang and Johnson, \{R. W.\} and G. Muralidharan and D. Shaddock and T. Zhang",
year = "2011",
language = "English",
isbn = "9781618392619",
series = "Materials Science and Technology Conference and Exhibition 2011, MS and T'11",
pages = "142--149",
booktitle = "Materials Science and Technology Conference and Exhibition 2011, MS and T'11",
note = "Materials Science and Technology Conference and Exhibition 2011, MS and T'11 ; Conference date: 16-10-2011 Through 20-10-2011",
}