Effect of heat treatment on phase stability, microstructure, and thermal conductivity of plasma-sprayed YSZ

R. W. Trice, Y. Jennifer Su, J. R. Mawdsley, K. T. Faber, A. R. De Arellano-López, Hsin Wang, W. D. Porter

Research output: Contribution to journalArticlepeer-review

155 Scopus citations

Abstract

The effects of the heat treatment on phase stability, microstructure, and thermal conductivity of plasma-sprayed Y2O3-ZrO2 (YSZ) was investigated. Changes in the thermal conductivity of the coating which occurred during heat treatment were interpreted with respect to microstructural evolution. A metastable tetragonal zirconia phase was the predominant phase in the as-sprayed coating. The thermal conductivity was found to increase after every heat treatment. Changes in the phase stability and microstructure were investigated using X-ray diffraction and transmission electron microscopy.

Original languageEnglish
Pages (from-to)2359-2365
Number of pages7
JournalJournal of Materials Science
Volume37
Issue number11
DOIs
StatePublished - Jun 1 2002
Externally publishedYes

Funding

Technology Center, Cooperative Agreement No. DE-FC21-92MC29061, under subcontract 96-01-SR047. A. R. de Arellano-López was supported by the Es-chbach Visiting Scholar Program of the McCormick School of Engineering and Applied Science at North-western University. The thermal conductivity testing was supported by the U.S. DOE, Assistant Secretary for Energy Efficiency and Renewable Energy, Office of Transportation Technologies, as part of the HTML User Program under contract DE-AC05-00OR22725, managed by UT-Batelle, LLC.

FundersFunder number
Office of Transportation TechnologiesDE-AC05-00OR22725
UT-Batelle
U.S. Department of Energy
Office of Energy Efficiency and Renewable Energy
McCormick School of Engineering, Northwestern University

    Fingerprint

    Dive into the research topics of 'Effect of heat treatment on phase stability, microstructure, and thermal conductivity of plasma-sprayed YSZ'. Together they form a unique fingerprint.

    Cite this