Dynamic and Static Fatigue Behavior of Sintered Silicon Nitrides: II, Microstructure and Failure Analysis

Mary H. Rawlins; Theodore A. Nolan; Lawrence F. Allard; Victor J. Tennery

doi:10.1111/j.1151-2916.1989.tb07648.x

Dynamic and Static Fatigue Behavior of Sintered Silicon Nitrides: II, Microstructure and Failure Analysis

Mary H. Rawlins, Theodore A. Nolan, Lawrence F. Allard, Victor J. Tennery

Research output: Contribution to journal › Article › peer-review

10 Scopus citations

Abstract

The microstructures and failure mechanisms of a sintered silicon nitride, tested under dynamic and static fatigue conditions, were studied. For longer test times at 1000°C, all specimens showed a slow crack growth mechanism of failure, with failure generally initiating at a defect. Even more importantly, these specimens contained cracks in addition to the failure fracture which extended into the material surrounding the initiation site. The cracking always appeared to occur within an amorphous grain‐boundary phase.

Original language	English
Pages (from-to)	1338-1342
Number of pages	5
Journal	Journal of the American Ceramic Society
Volume	72
Issue number	8
DOIs	https://doi.org/10.1111/j.1151-2916.1989.tb07648.x
State	Published - Aug 1989
Externally published	Yes

Keywords

fatigue
mechanical properties
microstructure
silicon nitride
sintering

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10.1111/j.1151-2916.1989.tb07648.x

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abstract = "The microstructures and failure mechanisms of a sintered silicon nitride, tested under dynamic and static fatigue conditions, were studied. For longer test times at 1000°C, all specimens showed a slow crack growth mechanism of failure, with failure generally initiating at a defect. Even more importantly, these specimens contained cracks in addition to the failure fracture which extended into the material surrounding the initiation site. The cracking always appeared to occur within an amorphous grain‐boundary phase.",

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AB - The microstructures and failure mechanisms of a sintered silicon nitride, tested under dynamic and static fatigue conditions, were studied. For longer test times at 1000°C, all specimens showed a slow crack growth mechanism of failure, with failure generally initiating at a defect. Even more importantly, these specimens contained cracks in addition to the failure fracture which extended into the material surrounding the initiation site. The cracking always appeared to occur within an amorphous grain‐boundary phase.

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KW - mechanical properties

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KW - sintering

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Dynamic and Static Fatigue Behavior of Sintered Silicon Nitrides: II, Microstructure and Failure Analysis

Abstract

Keywords

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