Double-Sided Pressureless-Sintered-Silver Interconnects Fabricated by Reflow-Oven-Processing

A significant amount of development with sintered-silver as an alternative interconnect (or attachment or attach) material in power electronic devices has occurred since ~ 2010 at Oak Ridge National Laboratory's National Transportation Research Center. Continuous sponsorship of the work enabled improvements and understanding of several sequential processing steps which otherwise would not have occurred with a short duration or an intermittently funded project. The majority of that work has occurred with a focus on improving its processing and consequential mechanical reliability of the interconnect while promoting adaptability to power elect ronic device manufacturing. The work includes determining application issues of silver-sintering and the developing processes that would make it amenable for use with reflow oven sintering. As part of that work, co-development of maximum interconnect strength of the sintered-silver interconnect occurred, and that also involved examining candidate plating materials that could be used in concert with them for the "interconnect system". All of this work involved the consideration of a single sintered-silver interconnect.