Abstract
Since the last decade, power electronics is moving towards higher frequency and higher voltage applications. For this purpose, the use of silicon (Si) presents some limitations and new materials like Silicon Carbide (SiC) or more recently Gallium Nitride (GaN) have boomed. Because of its large bandgap and high breakdown voltage, GaN is a good candidate for high power device applications, as well as Radio Frequency (RF).
Original language | English |
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Title of host publication | 19th International Workshop on Junction Technology, IWJT 2019 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
ISBN (Electronic) | 9784863487277 |
DOIs | |
State | Published - Jun 2019 |
Externally published | Yes |
Event | 19th International Workshop on Junction Technology, IWJT 2019 - Kyoto, Japan Duration: Jun 6 2019 → Jun 7 2019 |
Publication series
Name | 19th International Workshop on Junction Technology, IWJT 2019 |
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Conference
Conference | 19th International Workshop on Junction Technology, IWJT 2019 |
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Country/Territory | Japan |
City | Kyoto |
Period | 06/6/19 → 06/7/19 |
Bibliographical note
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