TY - GEN
T1 - Doping of GaN grown on silicon via ion implantation
AU - Mazen, Frederic
AU - Coig, Marianne
AU - Lardeau-Falcy, Aurelien
AU - Amichi, Lynda
AU - Veillerot, Marc
AU - Licitra, C.
AU - Grenier, Adeline
AU - Biscarrat, Jerome
AU - Kanyandekwe, Joel
AU - Charles, Matthew
AU - Milesi, Frederic
N1 - Publisher Copyright:
© 2019 JSAP.
PY - 2019/6
Y1 - 2019/6
N2 - Since the last decade, power electronics is moving towards higher frequency and higher voltage applications. For this purpose, the use of silicon (Si) presents some limitations and new materials like Silicon Carbide (SiC) or more recently Gallium Nitride (GaN) have boomed. Because of its large bandgap and high breakdown voltage, GaN is a good candidate for high power device applications, as well as Radio Frequency (RF).
AB - Since the last decade, power electronics is moving towards higher frequency and higher voltage applications. For this purpose, the use of silicon (Si) presents some limitations and new materials like Silicon Carbide (SiC) or more recently Gallium Nitride (GaN) have boomed. Because of its large bandgap and high breakdown voltage, GaN is a good candidate for high power device applications, as well as Radio Frequency (RF).
UR - http://www.scopus.com/inward/record.url?scp=85072071194&partnerID=8YFLogxK
U2 - 10.23919/IWJT.2019.8802889
DO - 10.23919/IWJT.2019.8802889
M3 - Conference contribution
AN - SCOPUS:85072071194
T3 - 19th International Workshop on Junction Technology, IWJT 2019
BT - 19th International Workshop on Junction Technology, IWJT 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 19th International Workshop on Junction Technology, IWJT 2019
Y2 - 6 June 2019 through 7 June 2019
ER -