Dopant activation and deactivation in InGaAs during sub-millisecond thermal annealing

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

5 Scopus citations

Abstract

Dopant activation of Si implanted In0.53Ga0.47As (InGaAs) following laser spike annealing (LSA) was studied at temperatures up to 1000°C with dwells from 250 μs to 2000 μs. Temperatures of the InGaAs under LSA were directly measured using Pt thermistors and calibrated to the known decomposition temperature of a simple polymer. Using spatially resolved probes with single laser stripe scans, the temperature dependent activation and damage behaviors were determined. Compared to furnace annealing, LSA was found to increase active carrier concentration and extend the temperature limit before damage. CAPRES 4-point measurements were used to determine carrier activation while Raman analysis of the LO phonon peak and LO phonon-plasmon coupling mode (LOPCM) peak was used to monitor crystal quality and carrier concentrations. For a 1014 cm-2 Si implant at 20keV, a minimum sheet resistance of 135 Ω/sq was obtained for a 1000 μs dwell at 845°C, with a peak carrier concentration near 8×1018 cm-3.

Original languageEnglish
Title of host publicationSilicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 5
EditorsE. P. Gusev, P. J. Timans, F. Roozeboom, S. DeGendt, K. Kakushima, V. Narayanan, Z. Karim
PublisherElectrochemical Society Inc.
Pages117-124
Number of pages8
Edition4
ISBN (Electronic)9781607685395
DOIs
StatePublished - 2015
Externally publishedYes
EventSymposium on Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 5 - 227th ECS Meeting - Chicago, United States
Duration: May 24 2015May 28 2015

Publication series

NameECS Transactions
Number4
Volume66
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Conference

ConferenceSymposium on Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 5 - 227th ECS Meeting
Country/TerritoryUnited States
CityChicago
Period05/24/1505/28/15

Fingerprint

Dive into the research topics of 'Dopant activation and deactivation in InGaAs during sub-millisecond thermal annealing'. Together they form a unique fingerprint.

Cite this