Directed integration of tetracyanoquinodimethane-Cu organic nanowires into prefabricated device architectures

A low-temperature technique for the synthesis of single-crystal tetracyanoquinodimethane-Cu (TCNQ-Cu) organic nanowires between prefabricated electrodes by reactive chemical vapor deposition, is discussed. This technique, demonstrating the self-assembled integration of organic nanowires into devices, avoids the high temperatures that can damage pre-existing electrodes and other microelectronic components. This lateral bridging growth method can be used as a reproducible method for the directed assembly and integration of TCNQ-Cu nanobridges into prespecified locations on different substrates, eliminating the need for subsequent assembly processes. Such grown TCNQ-Cu nanowire-bridged electrodes hold promise for applications in high-density information storage as an organic electrical memory material due to the precise orientation and facile integration of the nanowires.