Directed assembly of carbon nanotube electronic circuits by selective area chemical vapor deposition on prepatterned catalyst electrode structures

Research output: Contribution to journalConference articlepeer-review

7 Scopus citations

Abstract

A method for the direct assembly of carbon nanotube (CNT) electronic circuits was presented. Fe thin film electrode structures were patterned on silicon dioxide covered Si wafers by electron-beam lithography. Chemical vapor deposition was performed with the Fe thin film acting as the catalyst. Transmission electron microscopy (TEM) imaging showed that CNTs were multiwalled and grew only on the catalyst film. They eventually bridged the micron size electrode gap and formed the CNT electronic circuits.

Original languageEnglish
Pages (from-to)3586-3589
Number of pages4
JournalJournal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Volume18
Issue number6
DOIs
StatePublished - Nov 2000
Event44th International Conference on Electron, Ion, and Photon Beam Technology and Nanofabrication - Rancho Mirage, CA, USA
Duration: May 30 2000Jun 2 2000

Fingerprint

Dive into the research topics of 'Directed assembly of carbon nanotube electronic circuits by selective area chemical vapor deposition on prepatterned catalyst electrode structures'. Together they form a unique fingerprint.

Cite this