Abstract
A method for the direct assembly of carbon nanotube (CNT) electronic circuits was presented. Fe thin film electrode structures were patterned on silicon dioxide covered Si wafers by electron-beam lithography. Chemical vapor deposition was performed with the Fe thin film acting as the catalyst. Transmission electron microscopy (TEM) imaging showed that CNTs were multiwalled and grew only on the catalyst film. They eventually bridged the micron size electrode gap and formed the CNT electronic circuits.
Original language | English |
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Pages (from-to) | 3586-3589 |
Number of pages | 4 |
Journal | Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures |
Volume | 18 |
Issue number | 6 |
DOIs | |
State | Published - Nov 2000 |
Event | 44th International Conference on Electron, Ion, and Photon Beam Technology and Nanofabrication - Rancho Mirage, CA, USA Duration: May 30 2000 → Jun 2 2000 |