Diffusion-coupled cohesive interface simulations of stress corrosion intergranular cracking in polycrystalline materials

Chao Pu, Yanfei Gao, Yanli Wang, T. L. Sham

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38 Scopus citations

Abstract

To study the stress corrosion intergranular cracking mechanism, a diffusion-coupled cohesive zone model (CZM) is proposed for the simulation of the stress-assisted diffusional process along grain boundaries and the mechanical response of grain boundary sliding and separation. This simulation methodology considers the synergistic effects of impurity diffusion driven by pressure gradient and degradation of grain boundary strength by impurity concentration. The diffusion-coupled CZM is combined with crystal plasticity finite element model (CPFEM) to simulate intergranular fracture of polycrystalline material under corrosive environment. Significant heterogeneity of the stress field and extensive impurity accumulation is observed at grain boundaries and junction points. Deformation mechanism maps are constructed with respect to the grain boundary degradation factor and applied strain rate, which dictate the transition from internal to near-surface intergranular fracture modes under various strain amplitudes and grain sizes.

Original languageEnglish
Pages (from-to)21-31
Number of pages11
JournalActa Materialia
Volume136
DOIs
StatePublished - Sep 1 2017

Funding

The research was sponsored by the U.S. Department of Energy, under contract DE-AC05-00OR22725 with Oak Ridge National Laboratory, managed and operated by UT-Battelle, LLC, and under Contract No. DE-AC02-06CH11357 with Argonne National Laboratory, managed and operated by UChicago Argonne LLC. Programmatic direction was provided by the Office of Nuclear Energy (YW, TLS), and also by the Office of Science, Basic Energy Sciences, Materials Sciences and Engineering Division (YFG). CP and YFG are grateful to Prof. Abner J. Salgado and Prof. Bob Dodds at the University of Tennessee for fruitful discussions on numerical algorithms.

Keywords

  • Cohesive interface model
  • Intergranular fracture
  • Stress-assisted diffusion

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