Development of packaging and modular control of thermoelectric clothes dryer, with performance evaluation

Viral K. Patel, Kyle R. Gluesenkamp

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

This paper provides an overview of a thermoelectric heat pump clothes dryer which was developed with the aim of reducing the significant primary energy consumption attributed to residential electric clothes drying in the United States (623 TBtu/yr). The use of thermoelectric modules in place of the conventional electric resistance heater resulted in a 40% reduction in the energy consumption of the system, compared to the minimum energy efficiency standard. This was achieved for the first time for a standard test load of 8.45 lb, using a clothes dryer prototype with a thermoelectric heat pump module as the sole heating mechanism. The current experimental prototype was developed after extensive modeling, system design and control optimization, and experimental system-level evaluation of control parameters. The demonstration of improved energy consumption has laid the foundation for future development of this technology.

Original languageEnglish
Title of host publicationASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2017, collocated with the ASME 2017 Conference on Information Storage and Processing Systems
PublisherAmerican Society of Mechanical Engineers
ISBN (Electronic)9780791858097
DOIs
StatePublished - 2017
EventASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2017, collocated with the ASME 2017 Conference on Information Storage and Processing Systems - San Francisco, United States
Duration: Aug 29 2017Sep 1 2017

Publication series

NameASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2017, collocated with the ASME 2017 Conference on Information Storage and Processing Systems

Conference

ConferenceASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2017, collocated with the ASME 2017 Conference on Information Storage and Processing Systems
Country/TerritoryUnited States
CitySan Francisco
Period08/29/1709/1/17

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