@inproceedings{6b9526127d6f46d69ce5cdfc53964cac,
title = "Development of Evaluation Technique on Thermal Impedance between Dissimilar Solids",
abstract = "The measurement technique of thermal impedance at an interface has been developed using the sample with a dummy thermal impedance. 304-series stainless steel with different thicknesses was utilized as a test material and was attached to copper blocks by Stycast 2850FT which is for adhesive and for dummy thermal impedance. The apparent thermal conductivities of the samples were measured at the range from 15 K to 250 K. Any two thicknesses of them were compared, and the information on the thermal conductivity of stainless steel and on the thermal impedance of the Stycast layer were extracted. According to the results compared with that of other studies, it was confirmed that the comparison between the samples with different thicknesses was one of the useful techniques to obtain the information on the thermal impedance.",
author = "A. Iwamoto and R. Maekawa and T. Mito",
note = "Publisher Copyright: {\textcopyright} 2004 American Institute of Physics.; 2003 Cryogenic Engineering Conference, CEC 2003 ; Conference date: 22-09-2003 Through 26-09-2003",
year = "2004",
month = jun,
day = "23",
doi = "10.1063/1.1774738",
language = "English",
series = "AIP Conference Proceedings",
publisher = "American Institute of Physics Inc.",
pages = "643--650",
editor = "John Pfotenhauer and {Van Sciver}, Steven and Albert Zeller and Jonathan Demko and Christopher Rey and {Weisend II}, {John G.} and John Barclay and Michael DiPirro and Quan-Sheng Shu and Peter Kittel and Edward Daly and Hull, {John R.} and Jennifer Lock and Joseph Waynert and Susan Breon and James Maddocks and John Zbasnik and Kelley, {Patrick J.} and Arkadiy Klebaner",
booktitle = "Advances in Cryogenic Engineering",
}