TY - GEN
T1 - Development of electrospun-fiber embedded microfluidic devices using microfabrication-free processes
AU - Sperduto, John
AU - Sebok, Michael
AU - Rossini, Michael
AU - Yan, Karen Chang
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2015/6/2
Y1 - 2015/6/2
N2 - Microfluidic devices are widely used in biomedical applications owing to their inherent advantages. Currently, most microfluidic devices are fabricated using microfabrication techniques, which require specialized equipment. This paper outlines a microfabrication-free method for making microfluidic devics via integrating two accessible and simple fabrication techniques, hydrogel molding and electrospinning (ES). Preliminary results demonstrate the feasibility of the method and potential for incorporating complex channels and device optimization.
AB - Microfluidic devices are widely used in biomedical applications owing to their inherent advantages. Currently, most microfluidic devices are fabricated using microfabrication techniques, which require specialized equipment. This paper outlines a microfabrication-free method for making microfluidic devics via integrating two accessible and simple fabrication techniques, hydrogel molding and electrospinning (ES). Preliminary results demonstrate the feasibility of the method and potential for incorporating complex channels and device optimization.
KW - electrospun fibers
KW - hydrogel molding
KW - Microfluidic devices
KW - multi-layer construction
UR - http://www.scopus.com/inward/record.url?scp=84941110741&partnerID=8YFLogxK
U2 - 10.1109/NEBEC.2015.7117128
DO - 10.1109/NEBEC.2015.7117128
M3 - Conference contribution
AN - SCOPUS:84941110741
T3 - 2015 41st Annual Northeast Biomedical Engineering Conference, NEBEC 2015
BT - 2015 41st Annual Northeast Biomedical Engineering Conference, NEBEC 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2015 41st Annual Northeast Biomedical Engineering Conference, NEBEC 2015
Y2 - 17 April 2015 through 19 April 2015
ER -