TY - GEN
T1 - Development of diffusion-bonding parameters for tungsten and tantalum to steel
AU - Nelson, A. T.
AU - Dombrowski, D. E.
AU - Maloy, S. A.
AU - Hosemann, P.
AU - Hubele, N. D.
PY - 2008
Y1 - 2008
N2 - In support of ongoing efforts to develop joining techniques suitable for elevated-temperature nuclear environments, diffusion bonding is being investigated as a means of joining tungsten and tantalum to each other as well as ferritic-martensitic stainless steels. A test matrix of bonding conditions with temperatures ranging from 900 to 1060 °C (1650-1940 °F), pressures extending from 3.5 - 70 MPa (500-10,000 psi), and bond times of 4 hours has been implemented to determine the conditions sufficient to achieve the required mechanical and thermal bond performance. Furthermore, several nickel-based platings have been investigated with respect to their ability to enhance the bond surface diffusion rates to allow for lower temperature bonding of the refractory metals to steel. Each bond's performance is evaluated according to its microstructural character, degree of elemental diffusion, avoidance of stable intermetallics, and achievement of full interfacial contact to ensure sufficient bond performance.
AB - In support of ongoing efforts to develop joining techniques suitable for elevated-temperature nuclear environments, diffusion bonding is being investigated as a means of joining tungsten and tantalum to each other as well as ferritic-martensitic stainless steels. A test matrix of bonding conditions with temperatures ranging from 900 to 1060 °C (1650-1940 °F), pressures extending from 3.5 - 70 MPa (500-10,000 psi), and bond times of 4 hours has been implemented to determine the conditions sufficient to achieve the required mechanical and thermal bond performance. Furthermore, several nickel-based platings have been investigated with respect to their ability to enhance the bond surface diffusion rates to allow for lower temperature bonding of the refractory metals to steel. Each bond's performance is evaluated according to its microstructural character, degree of elemental diffusion, avoidance of stable intermetallics, and achievement of full interfacial contact to ensure sufficient bond performance.
UR - http://www.scopus.com/inward/record.url?scp=84883217477&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:84883217477
SN - 9780979348884
T3 - Proceedings of the 7th International Conference on Tungsten, Refractory and Hardmaterials
SP - 9139
EP - 9157
BT - Proceedings of the 7th International Conference on Tungsten, Refractory and Hardmaterials
T2 - 7th International Conference on Tungsten, Refractory and Hardmaterials 2008
Y2 - 8 June 2008 through 12 June 2008
ER -