Design of a 3-D surface geometry acquisition system for highly irregular shaped objects: with application to CZ semiconductor manufacture

Vivek A. Sujan; Steven Dubowsky

Design of a 3-D surface geometry acquisition system for highly irregular shaped objects: with application to CZ semiconductor manufacture

Vivek A. Sujan
, Steven Dubowsky

Research output: Contribution to journal › Conference article › peer-review

4 Scopus citations

Abstract

A Robotic System is being developed to automate the crucible packing process in CZ semiconductor wafer production. It requires the delicate manipulation and packing of highly irregular polycrystalline silicon nuggets, into a fragile fused silica crucible. For this application, a dual optical 3-D surface geometry measuring system that uses active laser triangulation has been developed and successfully tested. One part of the system measures the geometry profile of a nugget being packed and the other the profile of the nuggets already in the crucible. A resolution of 1mm with 15 KHz sampling frequency is achieved. Data from the system is used by a packing algorithm to determine optimal nugget placement. The system is shown to achieve high production rates, required precision and cost effectiveness.

Original language	English
Pages (from-to)	951-956
Number of pages	6
Journal	Proceedings - IEEE International Conference on Robotics and Automation
Volume	2
State	Published - 1999
Externally published	Yes
Event	Proceedings of the 1999 IEEE International Conference on Robotics and Automation, ICRA99 - Detroit, MI, USA Duration: May 10 1999 → May 15 1999

Cite this

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title = "Design of a 3-D surface geometry acquisition system for highly irregular shaped objects: with application to CZ semiconductor manufacture",

abstract = "A Robotic System is being developed to automate the crucible packing process in CZ semiconductor wafer production. It requires the delicate manipulation and packing of highly irregular polycrystalline silicon nuggets, into a fragile fused silica crucible. For this application, a dual optical 3-D surface geometry measuring system that uses active laser triangulation has been developed and successfully tested. One part of the system measures the geometry profile of a nugget being packed and the other the profile of the nuggets already in the crucible. A resolution of 1mm with 15 KHz sampling frequency is achieved. Data from the system is used by a packing algorithm to determine optimal nugget placement. The system is shown to achieve high production rates, required precision and cost effectiveness.",

author = "Sujan, \{Vivek A.\} and Steven Dubowsky",

year = "1999",

language = "English",

volume = "2",

pages = "951--956",

journal = "Proceedings - IEEE International Conference on Robotics and Automation",

issn = "1050-4729",

note = "Proceedings of the 1999 IEEE International Conference on Robotics and Automation, ICRA99 ; Conference date: 10-05-1999 Through 15-05-1999",

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TY - JOUR

T1 - Design of a 3-D surface geometry acquisition system for highly irregular shaped objects

T2 - Proceedings of the 1999 IEEE International Conference on Robotics and Automation, ICRA99

AU - Sujan, Vivek A.

AU - Dubowsky, Steven

PY - 1999

Y1 - 1999

N2 - A Robotic System is being developed to automate the crucible packing process in CZ semiconductor wafer production. It requires the delicate manipulation and packing of highly irregular polycrystalline silicon nuggets, into a fragile fused silica crucible. For this application, a dual optical 3-D surface geometry measuring system that uses active laser triangulation has been developed and successfully tested. One part of the system measures the geometry profile of a nugget being packed and the other the profile of the nuggets already in the crucible. A resolution of 1mm with 15 KHz sampling frequency is achieved. Data from the system is used by a packing algorithm to determine optimal nugget placement. The system is shown to achieve high production rates, required precision and cost effectiveness.

AB - A Robotic System is being developed to automate the crucible packing process in CZ semiconductor wafer production. It requires the delicate manipulation and packing of highly irregular polycrystalline silicon nuggets, into a fragile fused silica crucible. For this application, a dual optical 3-D surface geometry measuring system that uses active laser triangulation has been developed and successfully tested. One part of the system measures the geometry profile of a nugget being packed and the other the profile of the nuggets already in the crucible. A resolution of 1mm with 15 KHz sampling frequency is achieved. Data from the system is used by a packing algorithm to determine optimal nugget placement. The system is shown to achieve high production rates, required precision and cost effectiveness.

UR - https://www.scopus.com/pages/publications/0032690603

M3 - Conference article

AN - SCOPUS:0032690603

SN - 1050-4729

VL - 2

SP - 951

EP - 956

JO - Proceedings - IEEE International Conference on Robotics and Automation

JF - Proceedings - IEEE International Conference on Robotics and Automation

Y2 - 10 May 1999 through 15 May 1999

ER -

Design of a 3-D surface geometry acquisition system for highly irregular shaped objects: with application to CZ semiconductor manufacture

Abstract

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