Design of a 3-D surface geometry acquisition system for highly irregular shaped objects: with application to CZ semiconductor manufacture

Vivek A. Sujan, Steven Dubowsky

Research output: Contribution to journalConference articlepeer-review

4 Scopus citations

Abstract

A Robotic System is being developed to automate the crucible packing process in CZ semiconductor wafer production. It requires the delicate manipulation and packing of highly irregular polycrystalline silicon nuggets, into a fragile fused silica crucible. For this application, a dual optical 3-D surface geometry measuring system that uses active laser triangulation has been developed and successfully tested. One part of the system measures the geometry profile of a nugget being packed and the other the profile of the nuggets already in the crucible. A resolution of 1mm with 15 KHz sampling frequency is achieved. Data from the system is used by a packing algorithm to determine optimal nugget placement. The system is shown to achieve high production rates, required precision and cost effectiveness.

Original languageEnglish
Pages (from-to)951-956
Number of pages6
JournalProceedings - IEEE International Conference on Robotics and Automation
Volume2
StatePublished - 1999
Externally publishedYes
EventProceedings of the 1999 IEEE International Conference on Robotics and Automation, ICRA99 - Detroit, MI, USA
Duration: May 10 1999May 15 1999

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