Abstract
A Robotic System is being developed to automate the crucible packing process in CZ semiconductor wafer production. It requires the delicate manipulation and packing of highly irregular polycrystalline silicon nuggets, into a fragile fused silica crucible. For this application, a dual optical 3-D surface geometry measuring system that uses active laser triangulation has been developed and successfully tested. One part of the system measures the geometry profile of a nugget being packed and the other the profile of the nuggets already in the crucible. A resolution of 1mm with 15 KHz sampling frequency is achieved. Data from the system is used by a packing algorithm to determine optimal nugget placement. The system is shown to achieve high production rates, required precision and cost effectiveness.
Original language | English |
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Pages (from-to) | 951-956 |
Number of pages | 6 |
Journal | Proceedings - IEEE International Conference on Robotics and Automation |
Volume | 2 |
State | Published - 1999 |
Externally published | Yes |
Event | Proceedings of the 1999 IEEE International Conference on Robotics and Automation, ICRA99 - Detroit, MI, USA Duration: May 10 1999 → May 15 1999 |