Design and test of copper Printed RF cavities

Christopher Nantista; Diana Gamzina; Christopher Ledford; Timothy Horn; Paul Carriere; Pedro Frigola

doi:10.1109/IVEC45766.2020.9520624

Design and test of copper Printed RF cavities

Christopher Nantista, Diana Gamzina, Christopher Ledford, Timothy Horn, Paul Carriere, Pedro Frigola

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

Additive manufacturing of high-quality copper using electron beam melting techniques has demonstrated significant progress toward suitability for production of vacuum electronics components. Additively manufactured low oxygen level copper wafers, as printed and annealed, have been tested in an RF cavity designed for surface resistivity measurements. Strings of coupled cavities for S-band and X-band traveling wave tubes have been designed for vertical additive manufacturing in powder bed systems, enabling significant cost reduction. The S-band RF cavity string design has been additively manufactured, processed and RF tested.

Original language	English
Title of host publication	2020 IEEE 21st International Conference on Vacuum Electronics, IVEC 2020
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	149-150
Number of pages	2
ISBN (Electronic)	9781538682883
DOIs	https://doi.org/10.1109/IVEC45766.2020.9520624
State	Published - Oct 19 2020
Externally published	Yes
Event	21st IEEE International Conference on Vacuum Electronics, IVEC 2020 - Monterey, United States Duration: Oct 19 2020 → Oct 22 2020

Publication series

Name	2020 IEEE 21st International Conference on Vacuum Electronics, IVEC 2020

Conference

Conference	21st IEEE International Conference on Vacuum Electronics, IVEC 2020
Country/Territory	United States
City	Monterey
Period	10/19/20 → 10/22/20

Funding

The authors would like to acknowledge contributions from Dr. Yuan Zheng and Prof. Neville C. Luhmann from UC Davis; Chris Pearson and Andy Nguyen from SLAC, the NCSU team and the Radiabeam team. This work has been funded by the Naval Sea Systems Command, Crane Division. (Contract no. N68335-18-C-0103).

Keywords

Additive manufacturing
Design for additive manufacturing
Oxygen free high-conductivity copper
RF cavities

Access to Document

10.1109/IVEC45766.2020.9520624

Cite this

Nantista, C., Gamzina, D., Ledford, C., Horn, T., Carriere, P., & Frigola, P. (2020). Design and test of copper Printed RF cavities. In 2020 IEEE 21st International Conference on Vacuum Electronics, IVEC 2020 (pp. 149-150). (2020 IEEE 21st International Conference on Vacuum Electronics, IVEC 2020). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IVEC45766.2020.9520624

@inproceedings{50fc40fa567b404bb03a55a830a1b977,

title = "Design and test of copper Printed RF cavities",

abstract = "Additive manufacturing of high-quality copper using electron beam melting techniques has demonstrated significant progress toward suitability for production of vacuum electronics components. Additively manufactured low oxygen level copper wafers, as printed and annealed, have been tested in an RF cavity designed for surface resistivity measurements. Strings of coupled cavities for S-band and X-band traveling wave tubes have been designed for vertical additive manufacturing in powder bed systems, enabling significant cost reduction. The S-band RF cavity string design has been additively manufactured, processed and RF tested.",

keywords = "Additive manufacturing, Design for additive manufacturing, Oxygen free high-conductivity copper, RF cavities",

author = "Christopher Nantista and Diana Gamzina and Christopher Ledford and Timothy Horn and Paul Carriere and Pedro Frigola",

note = "Publisher Copyright: {\textcopyright} 2020 IEEE.; 21st IEEE International Conference on Vacuum Electronics, IVEC 2020 ; Conference date: 19-10-2020 Through 22-10-2020",

year = "2020",

month = oct,

day = "19",

doi = "10.1109/IVEC45766.2020.9520624",

language = "English",

series = "2020 IEEE 21st International Conference on Vacuum Electronics, IVEC 2020",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "149--150",

booktitle = "2020 IEEE 21st International Conference on Vacuum Electronics, IVEC 2020",

}

Nantista, C, Gamzina, D, Ledford, C, Horn, T, Carriere, P & Frigola, P 2020, Design and test of copper Printed RF cavities. in 2020 IEEE 21st International Conference on Vacuum Electronics, IVEC 2020. 2020 IEEE 21st International Conference on Vacuum Electronics, IVEC 2020, Institute of Electrical and Electronics Engineers Inc., pp. 149-150, 21st IEEE International Conference on Vacuum Electronics, IVEC 2020, Monterey, United States, 10/19/20. https://doi.org/10.1109/IVEC45766.2020.9520624

Design and test of copper Printed RF cavities. / Nantista, Christopher; Gamzina, Diana; Ledford, Christopher et al.
2020 IEEE 21st International Conference on Vacuum Electronics, IVEC 2020. Institute of Electrical and Electronics Engineers Inc., 2020. p. 149-150 (2020 IEEE 21st International Conference on Vacuum Electronics, IVEC 2020).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Design and test of copper Printed RF cavities

AU - Nantista, Christopher

AU - Gamzina, Diana

AU - Ledford, Christopher

AU - Horn, Timothy

AU - Carriere, Paul

AU - Frigola, Pedro

PY - 2020/10/19

Y1 - 2020/10/19

N2 - Additive manufacturing of high-quality copper using electron beam melting techniques has demonstrated significant progress toward suitability for production of vacuum electronics components. Additively manufactured low oxygen level copper wafers, as printed and annealed, have been tested in an RF cavity designed for surface resistivity measurements. Strings of coupled cavities for S-band and X-band traveling wave tubes have been designed for vertical additive manufacturing in powder bed systems, enabling significant cost reduction. The S-band RF cavity string design has been additively manufactured, processed and RF tested.

AB - Additive manufacturing of high-quality copper using electron beam melting techniques has demonstrated significant progress toward suitability for production of vacuum electronics components. Additively manufactured low oxygen level copper wafers, as printed and annealed, have been tested in an RF cavity designed for surface resistivity measurements. Strings of coupled cavities for S-band and X-band traveling wave tubes have been designed for vertical additive manufacturing in powder bed systems, enabling significant cost reduction. The S-band RF cavity string design has been additively manufactured, processed and RF tested.

KW - Additive manufacturing

KW - Design for additive manufacturing

KW - Oxygen free high-conductivity copper

KW - RF cavities

UR - https://www.scopus.com/pages/publications/85115291380

U2 - 10.1109/IVEC45766.2020.9520624

DO - 10.1109/IVEC45766.2020.9520624

M3 - Conference contribution

AN - SCOPUS:85115291380

T3 - 2020 IEEE 21st International Conference on Vacuum Electronics, IVEC 2020

SP - 149

EP - 150

BT - 2020 IEEE 21st International Conference on Vacuum Electronics, IVEC 2020

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 21st IEEE International Conference on Vacuum Electronics, IVEC 2020

Y2 - 19 October 2020 through 22 October 2020

ER -

Nantista C, Gamzina D, Ledford C, Horn T, Carriere P, Frigola P. Design and test of copper Printed RF cavities. In 2020 IEEE 21st International Conference on Vacuum Electronics, IVEC 2020. Institute of Electrical and Electronics Engineers Inc. 2020. p. 149-150. (2020 IEEE 21st International Conference on Vacuum Electronics, IVEC 2020). doi: 10.1109/IVEC45766.2020.9520624

Design and test of copper Printed RF cavities

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