TY - GEN
T1 - Design and TCAD simulations of planar active-edge pixel sensors for future XFEL applications
AU - Dalla Betta, Gian Franco
AU - Batignani, Giovanni
AU - Benkechkache, Mohamed El Amine
AU - Bettarini, Stefano
AU - Casarosa, Giulia
AU - Comotti, Daniele
AU - Fabris, Lorenzo
AU - Forti, Francesco
AU - Grassi, Marco
AU - Latreche-Lassoued, Saida
AU - Lodola, Luca
AU - Malcovati, Piero
AU - Manghisoni, Massimo
AU - Mendicino, Roberto
AU - Morsani, Fabio
AU - Paladino, Antonio
AU - Pancheri, Lucio
AU - Paoloni, Eugenio
AU - Ratti, Lodovico
AU - Re, Valerio
AU - Rizzo, Giuliana
AU - Traversi, Gianluca
AU - Vacchi, Carla
AU - Verzellesi, Giovanni
AU - Xu, Hesong
N1 - Publisher Copyright:
© 2014 IEEE.
PY - 2016/3/10
Y1 - 2016/3/10
N2 - We report on the design and TCAD simulations of planar active-edge pixel sensors within the INFN PixFEL project. These devices are intended as one of the building blocks for the assembly of a multilayer, four-side buttable tile for X-ray imaging applications in future Free Electron Laser facilities. The requirements in terms of very wide dynamic range and tolerance to extremely high ionizing radiation doses call for high operation voltages. A comprehensive TCAD simulation study is presented, aimed at the best trade-offs between the minimization of the edge region size and the sensor breakdown voltage.
AB - We report on the design and TCAD simulations of planar active-edge pixel sensors within the INFN PixFEL project. These devices are intended as one of the building blocks for the assembly of a multilayer, four-side buttable tile for X-ray imaging applications in future Free Electron Laser facilities. The requirements in terms of very wide dynamic range and tolerance to extremely high ionizing radiation doses call for high operation voltages. A comprehensive TCAD simulation study is presented, aimed at the best trade-offs between the minimization of the edge region size and the sensor breakdown voltage.
UR - http://www.scopus.com/inward/record.url?scp=84965020690&partnerID=8YFLogxK
U2 - 10.1109/NSSMIC.2014.7431078
DO - 10.1109/NSSMIC.2014.7431078
M3 - Conference contribution
AN - SCOPUS:84965020690
T3 - 2014 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2014
BT - 2014 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2014
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2014
Y2 - 8 November 2014 through 15 November 2014
ER -