Abstract
A robotic system is developed to automate the packing of polycrystalline silicon nuggets into a fragile fused silica crucible in CZ semiconductor wafer production. The highly irregular shapes of the nuggets make this a difficult and challenging task. In this system, nugget grasping is done with a three-cup suction gripper and nugget manipulation is attained with a 7 DOF SCARA manipulator. An optical 3-D vision system, based on active laser triangulation, measures nugget and crucible profiles. A model-free Virtual Trial and Error packing algorithm determines optimal nugget placement in real time. A hybrid position-force control scheme has been implemented and tested for physical nugget placement. The integrated system achieves high production rates, required precision and cost effectiveness.
| Original language | English |
|---|---|
| Pages (from-to) | 1969-1975 |
| Number of pages | 7 |
| Journal | Proceedings - IEEE International Conference on Robotics and Automation |
| Volume | 2 |
| State | Published - 2000 |
| Externally published | Yes |
| Event | ICRA 2000: IEEE International Conference on Robotics and Automation - San Francisco, CA, USA Duration: Apr 24 2000 → Apr 28 2000 |