Crumpled graphene epoxy nanocomposites modified with polydopamine for advanced semiconductor packaging applications

Zhijian Sun, Yifan Liu, Ryan Wong, Michael Yu, Jiaxiong Li, Macleary Moran, Mohanalingam Kathaperumal, Ching Ping Wong

Research output: Contribution to journalArticlepeer-review

8 Scopus citations

Abstract

Graphene-based epoxy nanocomposites are effective TIMs due to the unique properties of graphene – extraordinarily high thermal conductivity and large specific surface area. However, graphene easily aggregates due to strong van der Waals interactions and has poor interfacial connections due to a smooth surface. In this work, a facile method fabricates highly crumpled graphene nanosheets. The crumpled architecture prevents graphene nanosheets from restacking and maintaining the high specific surface area. Polydopamine (PDA) is used to promote uniform dispersion of graphene through π−π bonds, reducing the thermal interface resistance. Additionally, it enhances the thermal transport between as a TIM as proved by experimentation and modeling. The resultant 2.5 wt% filler loading epoxy nanocomposites present a high through-plane thermal conductivity of 1.02 W/mK. They also have a low CTE, low viscosity, low moisture absorption, high electric resistivity, and high adhesion strength. These results provide insights into the design of graphene-based epoxy nanocomposites to meet TIMs requirements in high density 3D electronic packaging.

Original languageEnglish
Article number109709
JournalComposites Science and Technology
Volume230
DOIs
StatePublished - Nov 10 2022
Externally publishedYes

Funding

This work was supported by the Industry Consortium at the Georgia Tech Packaging Research Center (PRC). This work was performed in part at the Georgia Tech Institute for Electronics and Nanotechnology, a member of the National Nanotechnology Coordinated Infrastructure (NNCI), which is supported by the National Science Foundation (Grant ECCS-2025462 ).

Keywords

  • Crumpled graphene nanosheets
  • Epoxy nanocomposites
  • High thermal conductivity
  • Polydopamine modification
  • Semiconductor packaging

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