Coupling the High-Throughput Property Map to Machine Learning for Predicting Lattice Thermal Conductivity

Rinkle Juneja, George Yumnam, Swanti Satsangi, Abhishek K. Singh

Research output: Contribution to journalArticlepeer-review

74 Scopus citations

Abstract

Low thermal conductivity materials are crucial for applications such as thermoelectric conversion of waste heat to useful energy and thermal barrier coatings. On the other hand, high thermal conductivity materials are necessary for cooling electronic devices. However, search for such materials via explicit evaluation of thermal conductivity either experimentally or computationally is very challenging. Here, we carried out high-throughput ab initio calculations, on a dataset containing 195 binary, ternary, and quaternary compounds. The lattice thermal conductivity κl values of 120 dynamically stable and nonmetallic compounds are calculated, which span over 3 orders of magnitude. Among these, 11 ultrahigh and 15 ultralow κl materials are identified. An analysis of generated property map of this dataset reveals a strong dependence of κl on simple descriptors, namely, maximum phonon frequency, integrated Grüneisen parameter up to 3 THz, average atomic mass, and volume of the unit cell. Using these descriptors, a Gaussian process regression-based machine learning (ML) model is developed. The model predicts log-scaled κl with a very small root mean square error of ∼0.21. Comparatively, the Slack model, which uses more involved parameters, severely overestimates κl. The superior performance of our ML model can ensure a reliable and accelerated search for multitude of low and high thermal conductivity materials.

Original languageEnglish
Pages (from-to)5145-5151
Number of pages7
JournalChemistry of Materials
Volume31
Issue number14
DOIs
StatePublished - Jul 23 2019
Externally publishedYes

Funding

The authors thank Atsuto Seko, Atsushi Togo, and Isao Tanaka from Department of Materials Science and Engineering, Kyoto University, Kyoto, Japan for the useful discussions and providing computational facilities. R.J., G.Y., and A.K.S. acknowledge Isao Tanaka and the Kyoto University for supporting their stay to carry out initial part of work. R.J. acknowledges Morgana Ribas for useful inputs. R.J. thanks DST for INSPIRE fellowship (IF150848). The authors thank the Materials Research Centre, Thematic Unit of Excellence, Materials Informatics Initiative of IISc (MI 3 ), and Supercomputer Education and Research Centre, Indian Institute of Science, for providing computing facilities.

FundersFunder number
Department of Science and Technology, Ministry of Science and Technology, IndiaIF150848

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