Copper Reconsidered: Material Innovations to Transform Vacuum Electronics

Diana Gamzina, Michael Kozina, Apurva Mehta, Emilio A. Nanni, Sami Tantawi, Paul B. Welander, Timothy Horn, Christopher Ledford

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

10 Scopus citations

Abstract

Copper is critical to the manufacturing of vacuum electronic devices due to its high electrical and thermal conductivities. It enables high RF performance while maintaining low thermal losses. Copper is also responsible for some of the challenges: RF power output is often limited by the strength of copper and RF breakdown is induced by copper transformation at the vacuum surface. Recent advances in understanding of RF interaction with copper offer insight into its limitations and how they may be mitigated. Emerging manufacturing technologies, such as electron beam melting of copper, can be employed to achieve a stronger copper state in the RF structures, opening opportunities for higher power and more compact vacuum electronics. As copper focused additive manufacturing evolves, strengthening mechanisms can be incorporated into the material to produce desired material properties locally, further enhancing performance capabilities of vacuum devices.

Original languageEnglish
Title of host publication2019 International Vacuum Electronics Conference, IVEC 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781538675342
DOIs
StatePublished - Apr 2019
Externally publishedYes
Event2019 International Vacuum Electronics Conference, IVEC 2019 - Busan, Korea, Republic of
Duration: Apr 28 2019May 1 2019

Publication series

Name2019 International Vacuum Electronics Conference, IVEC 2019

Conference

Conference2019 International Vacuum Electronics Conference, IVEC 2019
Country/TerritoryKorea, Republic of
CityBusan
Period04/28/1905/1/19

Funding

This work has been supported by the Basic Energy Science and High Energy Physics offices in the Office of Science at the Department of Energy under SLAC management and operation contract DE-AC02-76SF00515 as well as Office of Naval Research Small Business Technology Transfer program under CRADA No. 18-0018-CR with RadiaBeam Technologies.

Keywords

  • RF breakdown
  • additive manufacturing
  • copper
  • strengthening mechanisms
  • thermo-mechanics

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