Abstract
Copper is critical to the manufacturing of vacuum electronic devices due to its high electrical and thermal conductivities. It enables high RF performance while maintaining low thermal losses. Copper is also responsible for some of the challenges: RF power output is often limited by the strength of copper and RF breakdown is induced by copper transformation at the vacuum surface. Recent advances in understanding of RF interaction with copper offer insight into its limitations and how they may be mitigated. Emerging manufacturing technologies, such as electron beam melting of copper, can be employed to achieve a stronger copper state in the RF structures, opening opportunities for higher power and more compact vacuum electronics. As copper focused additive manufacturing evolves, strengthening mechanisms can be incorporated into the material to produce desired material properties locally, further enhancing performance capabilities of vacuum devices.
Original language | English |
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Title of host publication | 2019 International Vacuum Electronics Conference, IVEC 2019 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
ISBN (Electronic) | 9781538675342 |
DOIs | |
State | Published - Apr 2019 |
Externally published | Yes |
Event | 2019 International Vacuum Electronics Conference, IVEC 2019 - Busan, Korea, Republic of Duration: Apr 28 2019 → May 1 2019 |
Publication series
Name | 2019 International Vacuum Electronics Conference, IVEC 2019 |
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Conference
Conference | 2019 International Vacuum Electronics Conference, IVEC 2019 |
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Country/Territory | Korea, Republic of |
City | Busan |
Period | 04/28/19 → 05/1/19 |
Funding
This work has been supported by the Basic Energy Science and High Energy Physics offices in the Office of Science at the Department of Energy under SLAC management and operation contract DE-AC02-76SF00515 as well as Office of Naval Research Small Business Technology Transfer program under CRADA No. 18-0018-CR with RadiaBeam Technologies.
Keywords
- RF breakdown
- additive manufacturing
- copper
- strengthening mechanisms
- thermo-mechanics