Contact drying of printed sinterable-silver paste

Andrew A. Wereszczak, Max C. Modugno, Branndon R. Chen, William M. Carty

Research output: Contribution to journalArticlepeer-review

14 Scopus citations

Abstract

Drying of stencil-, screen-, or dispense-printed paste is a crucial, yet taken-for-granted, presintering step for sinterable-silver (SS) interconnect processing and ultimately its reliability. If the paste's solvent is not sufficiently removed during drying, then entrapped gas can result, and that leads to the formation of thermal-, strength-, and reliability-limiting defects in the later-sintered interconnect layer. Presently advocated drying strategies for wet silver paste cause either a limit of associated size or area or require pressure assistance during subsequent sintering. Alternatively, open-face contact drying (OContDry) from contact heating or conductive heating (a method used in industrial processes) offers the potential to overcome those limitations with SS paste. However, satisfactory strength of its final sintered structure must be proven prior to any potential adoption. In this paper, the achievement of a combination of relatively large shear failure stress with low scatter for OContDry SS was demonstrated. This is significant because OContDry enables greater processing versatility with SS interconnects and several other advantages too.

Original languageEnglish
Article number2752140
Pages (from-to)2079-2086
Number of pages8
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Volume7
Issue number12
DOIs
StatePublished - Dec 2017

Funding

Manuscript received January 23, 2017; revised April 8, 2017 and July 8, 2017; accepted September 11, 2017. Date of publication October 9, 2017; date of current version December 21, 2017. This work was supported in part by the Propulsion Materials Program and in part by the Electric Drive Technologies Programs, DOE Vehicle Technologies Office with UT-Battelle, LLC, under Contract DE-AC05-00OR22725. Recommended for publication by Associate Editor P. McCluskey upon evaluation of reviewers’ comments. (Corresponding author: Andrew A. Wereszczak.) A. A. Wereszczak is with the Oak Ridge National Laboratory, Materials Science and Technology Division, Oak Ridge, TN 37831 USA (e-mail: [email protected]).

Keywords

  • Conductive drying
  • Interconnects
  • Open-face contact drying (OContDry)
  • Open-face convective drying (OVectDry)
  • Sintered silver (SS)

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