Abstract
The stacks of III-V materials, grown on the Si substrate, that are considered for the fabrication of highly scaled devices tend to develop structural defects, in particular threading dislocations (TDs), which affect device electrical properties. We demonstrate that the characteristics of the TD sites can be analyzed by using the conductive atomic force microscopy technique with nanoscale spatial resolution within a wide temperature range. In the studied InGaAs/Si stacks, electrical conductance through the TD sites was found to be governed by the Poole-Frenkel emission, while the off-TDs conductivity is dominated by the thermionic emission process.
Original language | English |
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Article number | 7422696 |
Pages (from-to) | 640-643 |
Number of pages | 4 |
Journal | IEEE Electron Device Letters |
Volume | 37 |
Issue number | 5 |
DOIs | |
State | Published - May 2016 |
Externally published | Yes |
Funding
This work was supported in part by the Departament d'Universitats, Recerca i Societat de la Informació within the Generalitat de Catalunya under Grant 2014SGR-384 and in part by the Ministerio de Economía y Competitividad and the Secretaría de Estado de Investigación, Desarrollo e Innovación through the European Regional Development Fund under Grant TEC2013-45638-C3-1-R.
Funders | Funder number |
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Desarrollo e Innovación | |
Secretaría de Estado de Investigación | |
Generalitat de Catalunya | 2014SGR-384 |
Ministerio de Economía y Competitividad | |
Departament d'Universitats, Recerca i Societat de la Informació | |
European Regional Development Fund | TEC2013-45638-C3-1-R |
Keywords
- CAFM
- Poole Frenkel emission
- semiconductor defects
- thermionic emission
- threading dislocation